A3P400-2FGG144

The A3P400-2FGG144 is a ProASIC3 flash-based Field Programmable Gate Array from Microchip Technology. It provides a moderate logic capacity with 9,216 logic elements and approximately 55 Kbits (55,296 bits) of on-chip RAM, along with 97 user I/O pins and an estimated 400,000 gates.

Built in a 144-LBGA surface-mount package with a supplier device package of 144-FPBGA (13×13), this commercial-grade device operates from a core supply of 1.425 V to 1.575 V and across an operating temperature range of 0 °C to 85 °C. It is RoHS compliant for environmental regulatory requirements.

Key Features

• Core Logic  9,216 logic elements provide a balanced resource set for implementing combinational and sequential logic functions.
• Embedded Memory  Approximately 55 Kbits (55,296 bits) of on-chip RAM for buffering, state storage, and small memory-mapped functions.
• I/O Capacity  97 user I/O pins to interface with external peripherals, sensors, and I/O subsystems.
• Logic Scale  An estimated 400,000 gates enabling a range of mid-density FPGA implementations.
• Package & Mounting  144-LBGA package (supplier: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB integration.
• Power  Core voltage supply specified from 1.425 V to 1.575 V to match system power rails and design constraints.
• Operating Range  Commercial grade operation from 0 °C to 85 °C suitable for general-purpose embedded applications.
• Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.

Unique Advantages

• Moderate Logic Capacity: 9,216 logic elements and ~400,000 gates provide a practical balance of resources for mid-range designs without unnecessary overhead.
• On-Chip Memory: Approximately 55 Kbits of embedded RAM enables local buffering and state storage, reducing external memory needs for many applications.
• Versatile I/O Count: 97 I/O pins allow flexible interfacing to peripherals and external devices, simplifying board-level integration.
• Compact Surface-Mount Packaging: 144-LBGA (13×13) footprint supports dense PCB layouts and reliable solder mounting for production assemblies.
• Commercial-Grade Availability: Designed for 0 °C to 85 °C operation and RoHS compliance, aligning with mainstream embedded product requirements.

Why Choose A3P400-2FGG144?

The A3P400-2FGG144 positions itself as a practical ProASIC3 FPGA option for engineers needing a balanced mix of logic, embedded memory, and I/O in a compact LBGA package. Its specified core voltage range and commercial operating temperature make it suitable for a wide range of general-purpose embedded designs.

This device is a fit for teams looking for a moderately sized, RoHS-compliant FPGA that simplifies board-level integration through a surface-mount 144-LBGA package while providing a clear set of on-chip resources for implementing mid-density logic and memory functions.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the A3P400-2FGG144.