A3P400-2FG256

The A3P400-2FG256 is a ProASIC3 family FPGA in a 256-LBGA package designed for commercial electronic designs that require reconfigurable logic and a sizable I/O count. It provides 9,216 logic elements, approximately 55,296 bits of on-chip RAM and 178 I/O in a surface-mount 256-FPBGA (17×17) package.

Operating from a 1.425 V to 1.575 V supply and rated for 0 °C to 85 °C, this RoHS-compliant device targets commercial-grade applications where moderate-density logic, on-chip memory and a high pin count are required.

Key Features

• Core Logic  9,216 logic elements (LEs) and approximately 400,000 gates provide programmable combinational and sequential resources for custom logic implementation.
• On-chip Memory  Approximately 55,296 bits of total RAM for embedded data storage and buffering within the FPGA fabric.
• I/O Capacity  178 I/O pins support extensive external interfacing and signal routing for multi-peripheral designs.
• Power and Supply  Single voltage supply range of 1.425 V to 1.575 V for the core, enabling defined power planning in system designs.
• Package and Mounting  256-LBGA / 256-FPBGA (17×17) package in a surface-mount form factor for compact board integration.
• Environmental and Grade  Commercial grade device with RoHS compliance and an operating temperature range of 0 °C to 85 °C.

Typical Applications

• Commercial Embedded Systems  Use the device where moderate-density programmable logic and on-chip RAM are needed to implement control, timing or custom processing functions within commercial equipment.
• Prototyping and Development  Suitable for development platforms and proof-of-concept designs that require up to 9,216 logic elements and significant I/O for external peripherals.
• Peripheral and I/O Bridging  Leverage 178 I/O pins to implement interface bridging, protocol conversion or multi-sensor aggregation in compact systems.

Unique Advantages

• Balanced Logic Density:  9,216 logic elements deliver a mid-range capacity for implementing complex finite-state machines, datapaths and glue logic without over-sizing the solution.
• On-Chip Memory for Local Storage:  Approximately 55,296 bits of RAM enable buffering and small data-store needs directly in the FPGA fabric, reducing external memory dependencies.
• High I/O Count:  178 available I/O pins support broad connectivity to peripherals, sensors and external interfaces within a single package.
• Compact Surface-Mount Package:  256-LBGA / 256-FPBGA (17×17) packaging enables dense board layouts while maintaining a high pin count for system integration.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C to match typical commercial electronic product environments.
• Regulatory Hygiene:  RoHS-compliant construction supports regulatory requirements for lead-free assembly and environmental considerations.

Why Choose A3P400-2FG256?

The A3P400-2FG256 positions itself as a commercial-grade, mid-density FPGA option within the ProASIC3 family that blends substantial logic resources, on-chip RAM and a high I/O count in a compact 256-LBGA surface-mount package. Its defined supply voltage range and commercial temperature rating make it suitable for designs that require predictable electrical characteristics and moderate environmental operating conditions.

This device is well suited to engineers and procurement teams building commercial embedded systems, development platforms or I/O-centric modules who need a reconfigurable, RoHS-compliant FPGA with clear, verifiable specifications for logic, memory, I/O and packaging.

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