A3P400-2FGG144I

The A3P400-2FGG144I is a ProASIC3 Field Programmable Gate Array (FPGA) manufactured by Microchip Technology. It delivers a compact, industrial-grade FPGA building block with 9,216 logic elements and approximately 400,000 gates for mid-density programmable logic designs.

Designed for surface-mount applications, this device combines on-chip memory, flexible I/O and a small 144-LBGA package to address industrial control, instrumentation and embedded logic tasks that require operation across an extended temperature range.

Key Features

• Core Logic  9,216 logic elements providing programmable fabric for custom logic, glue logic and state-machine implementations.
• Gate Capacity  Approximately 400,000 gates to support mid-density logic integration in a single device.
• On-Chip Memory  Total on-chip RAM of 55,296 bits to support buffering, small FIFOs and embedded storage.
• I/O Count  97 user I/O pins to interface with peripherals, sensors and buses in compact systems.
• Power  Core supply voltage range of 1.425 V to 1.575 V for compatible low-voltage system designs.
• Package & Mounting  144-LBGA (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for dense PCB implementations.
• Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C for thermally demanding environments.
• Environmental Compliance  RoHS compliant to meet standard lead-free manufacturing requirements.

Typical Applications

• Industrial Control  Programmable logic and I/O aggregation for motor control, PLC interfaces and factory automation equipment operating across industrial temperature ranges.
• Instrumentation  Signal conditioning, data formatting and timing control in measurement and test systems using on-chip RAM and dense logic.
• Embedded Systems  Glue logic, custom protocol bridging and peripheral control where compact packaging and a moderate number of I/O are required.

Unique Advantages

• Dense Logic Integration: 9,216 logic elements and ~400,000 gates allow consolidation of multiple functions into a single device, reducing board-level complexity.
• On-Board Memory: 55,296 bits of embedded RAM provide local buffering and small data storage without external memory components.
• Flexible I/O Count: 97 user I/O pins support a variety of peripheral interfaces and sensor connections in compact designs.
• Compact Surface-Mount Package: 144-LBGA (13×13 FPBGA) enables high-density PCB layouts while maintaining robust electrical performance.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for reliable operation in thermally challenging industrial environments.
• Lead-Free Compliance: RoHS-compliant construction supports lead-free manufacturing processes.

Why Choose A3P400-2FGG144I?

The A3P400-2FGG144I provides a balanced combination of mid-range programmable logic capacity, embedded memory and a generous I/O complement in a compact 144-LBGA surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for deployed systems that require durability and regulatory alignment.

Manufactured by Microchip Technology, this device is positioned for engineers and procurement teams building industrial control, instrumentation and embedded logic solutions that need reliable, mid-density FPGA resources and compact board-level integration.

Request a quote or submit an inquiry today to discuss pricing, availability and delivery for the A3P400-2FGG144I.