A3P400-2PQ208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP |
|---|---|
| Quantity | 735 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of A3P400-2PQ208I – ProASIC3 FPGA, 151 I/O, 208‑BFQFP
The A3P400-2PQ208I is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial applications that require programmable logic and broad I/O capability. It provides a balance of logic density, on-chip memory, and I/O in a 208‑pin surface-mount package suitable for systems operating across an extended temperature range.
With 9,216 logic elements and 151 I/O pins, this device targets embedded and industrial designs that need configurable digital logic, moderate embedded memory, and reliable operation from −40 °C to 100 °C.
Key Features
- Core Logic — 9,216 logic elements (logic element cells) supporting up to 400,000 gates for implementing custom digital functions and control logic.
- Embedded Memory — 55,296 bits of on‑chip RAM, approximately 0.055 Mbits of embedded memory for buffering, registers, and small data structures.
- I/O Density — 151 I/O pins to support multiple interfaces and signal paths in compact designs.
- Power Supply — Core voltage range specified at 1.425 V to 1.575 V for integration into regulated power domains.
- Package & Mounting — 208‑BFQFP package; supplier device package listed as 208‑PQFP (28×28). Surface-mount mounting type for modern PCB assembly.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental needs.
- Regulatory — RoHS compliant, supporting lead‑free manufacturing requirements.
Typical Applications
- Industrial Control — Implement custom control logic and I/O aggregation for automation systems that require industrial temperature operation.
- Embedded Systems — Provide programmable logic and up to 151 I/O for embedded applications needing configurable interfaces and mid-range logic density.
- Instrumentation and Test Equipment — Use on-chip memory and logic elements to implement data handling, signal routing, and custom processing blocks within test platforms.
Unique Advantages
- Balanced Logic Capacity: 9,216 logic elements and 400,000 gates enable moderate-complexity designs without excessive PCB real estate.
- Ample I/O Count: 151 I/O pins support multiple signals and peripherals directly from a single device footprint.
- On‑Chip RAM: 55,296 bits of embedded memory (≈0.055 Mbits) for local buffering and small storage needs, reducing external memory requirements.
- Industrial Temperature Rating: Operation from −40 °C to 100 °C addresses temperature demands of industrial applications.
- Surface‑Mount, High‑Pin Package: 208‑pin BFQFP/PQFP (28×28) package supports high I/O density in a manufacturable SMD form factor.
- RoHS Compliant: Meets lead‑free manufacturing standards for regulated environments.
Why Choose A3P400-2PQ208I?
The A3P400-2PQ208I positions itself as a practical choice for designers who need a mid-density FPGA with substantial I/O and industrial temperature capability. Its combination of 9,216 logic elements, 151 I/Os, and on‑chip memory makes it suitable for embedded and industrial projects that require configurable logic without large-scale device complexity.
Manufactured by Microchip Technology and provided in a surface-mount 208‑pin package, this device delivers a compact, RoHS‑compliant option for production environments where temperature range, I/O count, and moderate logic density are key selection criteria.
Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for the A3P400-2PQ208I.

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