A3P400-FG144I

The A3P400-FG144I is a ProASIC3 field-programmable gate array (FPGA) IC from Microchip Technology. It provides mid-density programmable logic with 9,216 logic elements, 97 user I/O pins and 400,000 gates in a compact 144-LBGA package.

Designed for industrial-grade applications, the device combines on-chip embedded memory and flexible I/O in a surface-mount package and supports extended operating temperatures and a defined core voltage supply range.

Key Features

• Core Logic  9,216 logic elements (cells) delivering 400,000 gates for mid-density FPGA designs.
• Embedded Memory  Approximately 0.055 Mbits of on-chip RAM (55,296 total RAM bits) to support buffers, FIFOs and small data structures.
• I/O  97 user I/O pins to support a wide range of peripheral interfaces and system interconnects.
• Power  Core voltage supply specified at 1.425 V to 1.575 V for deterministic power design and integration.
• Package & Mounting  144-LBGA package; supplier device package listed as 144-FPBGA (13x13). Surface-mount mounting type for compact PCB footprints.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• Industrial control and automation  Implement control logic and I/O aggregation in industrial systems using the device’s 9,216 logic elements and industrial temperature rating.
• Embedded system glue logic  Provide configurable protocol bridging, interfacing and custom logic between system components with 97 available I/Os.
• Signal processing and buffering  Use the on-chip RAM for temporary storage and FIFO implementations within mid-density logic designs.

Unique Advantages

• Mid-density programmable logic: 9,216 logic elements and 400,000 gates offer a balance of capacity and resource efficiency for many embedded designs.
• Compact, manufacturable package: 144-LBGA surface-mount package and 144-FPBGA (13x13) supplier package facilitate compact PCB layouts and automated assembly.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial deployments.
• Defined core voltage: 1.425 V to 1.575 V supply specification simplifies power-supply design and system integration.
• RoHS compliant: Conforms to RoHS environmental requirements for modern manufacturing and regulatory needs.

Why Choose A3P400-FG144I?

The A3P400-FG144I positions itself as a reliable mid-density FPGA option for designs that require a pragmatic mix of logic capacity, embedded memory and a substantial I/O count in a compact LBGA footprint. Its industrial temperature rating and defined core voltage make it suitable for production systems that must operate across a wide temperature range.

This device is suited for engineers and procurement teams targeting configurable logic for industrial control, interface bridging and embedded processing tasks where RoHS compliance and surface-mount packaging are required.

Request a quote or submit a procurement inquiry for the A3P400-FG144I to begin your sourcing and design planning.