A3P400-FG144

The A3P400-FG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for mid-density programmable logic applications. It provides a balance of logic capacity, embedded memory and I/O in a compact surface-mount package.

Key device characteristics include 400,000 gates, 9,216 logic elements, approximately 55 kbits of embedded memory, and 97 I/O pins. The device operates from a 1.425 V to 1.575 V supply and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core Logic 9,216 logic elements delivering a total of 400,000 gates to implement custom digital functions and state machines.
• Embedded Memory Approximately 55 kbits of on-chip RAM for small data buffers, FIFOs and control storage.
• I/O Capacity 97 general-purpose I/O pins to support a wide range of external interfaces and parallel/serial connectivity.
• Power Nominal supply range of 1.425 V to 1.575 V for core power delivery in system designs.
• Package & Mounting 144-LBGA surface-mount package (supplier package: 144-FPBGA, 13×13) for space-efficient board integration.
• Operating Range & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
• Regulatory RoHS compliant for lead-free assemblies and regulatory alignment in commercial products.

Typical Applications

• Custom Logic and Glue Logic — Implement application-specific combinational and sequential logic where up to 400,000 gates and 9,216 logic elements are required.
• Interface and I/O Expansion — Use the 97 I/O pins to bridge multiple peripherals, add protocol translators or implement parallel interfaces.
• Embedded Control and Peripheral Integration — Combine logic, on-chip RAM and I/O to consolidate control functions and peripheral handling into a single device.
• Prototyping and Mid-Density FPGA Designs — Suitable for proof-of-concept or production designs needing moderate logic capacity in a compact LBGA package.

Unique Advantages

• Balanced Logic Capacity: 9,216 logic elements and 400,000 gates provide a practical mix of resources for mid-density digital designs.
• On-chip Memory: Approximately 55 kbits of embedded RAM reduces dependence on external memory for small buffers and control structures.
• Generous I/O Count: Ninety-seven I/Os enable flexible interfacing to sensors, peripherals and external buses without additional components.
• Compact Surface-Mount Package: 144-LBGA (13×13) package supports space-conscious PCB layouts while maintaining robust connectivity.
• Commercial-Grade Specification: Rated for 0 °C to 85 °C operation, suitable for mainstream commercial and embedded applications.
• RoHS Compliant: Facilitates lead-free manufacturing and compliance with common environmental requirements.

Why Choose A3P400-FG144?

The A3P400-FG144 delivers a practical combination of logic, memory and I/O in a compact package, making it well suited for commercial embedded designs that require mid-range FPGA resources. Its specified voltage range and operating temperature make it appropriate for standard commercial applications where predictable, verifiable device parameters are required.

Designed by Microchip Technology, the device offers a clear resource profile—400,000 gates, 9,216 logic elements, approximately 55 kbits of on-chip RAM and 97 I/O—that helps engineers match device capability to design requirements and manage board-level integration effectively.

Request a quote or submit an inquiry for the A3P400-FG144 by providing the part number and your quantity requirements to receive pricing and availability information.