A3P400-FG256

The A3P400-FG256 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology, offering a mid-range logic density and a balanced mix of on-chip memory and I/O resources. Its feature set is optimized for designs that require roughly 9,216 logic elements, 178 user I/O pins, and on-chip RAM in a compact BGA package.

With a supply voltage window of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets applications that need a compact, low-voltage FPGA solution in surface-mount form factors.

Key Features

• Core Logic Approximately 9,216 logic elements supporting typical mid-range FPGA designs.
• Embedded Memory Approximately 0.055 Mbits of on-chip RAM (55,296 bits) for buffering, state storage, and small data structures.
• I/O Capacity 178 general-purpose I/O pins to support multiple interfaces and peripheral connections.
• Gate Count 400,000 gates to represent overall device capacity for combinational and sequential logic.
• Power Device supply voltage range: 1.425 V to 1.575 V for low-voltage system integration.
• Package & Mounting 256-LBGA package, supplier device package listed as 256-FPBGA (17x17), and surface-mount mounting type for compact PCB layouts.
• Operating Range & Grade Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant, meeting common environmental requirements for electronics assembly.

Unique Advantages

• Balanced mid-range resources: 9,216 logic elements and 400,000 gates provide a clear fit for medium-complexity designs without unnecessary overcapacity.
• Compact, high-density package: 256-LBGA (supplier: 256-FPBGA (17x17)) enables a small PCB footprint while providing 178 I/O pins.
• Low-voltage operation: Narrow supply window (1.425 V–1.575 V) simplifies integration into low-voltage power domains.
• On-chip RAM for control and buffering: Approximately 0.055 Mbits of embedded memory supports local data storage and small FIFOs.
• Surface-mount convenience: Surface-mount mounting type aligns with modern automated assembly processes.
• Regulatory readiness: RoHS compliance helps address environmental and assembly compliance requirements.

Why Choose A3P400-FG256?

The A3P400-FG256 positions itself as a practical, commercially graded FPGA option for designs that require moderate logic density, substantial I/O, and on-chip RAM in a compact BGA footprint. Its specification set—9,216 logic elements, 178 I/Os, 55,296 bits of embedded RAM, and a 256-LBGA package—makes it suitable for applications where PCB space, I/O count, and low-voltage operation are key considerations.

For engineering teams and procurement professionals seeking a reliable, RoHS-compliant FPGA from Microchip Technology with clearly defined electrical and thermal ranges, the A3P400-FG256 delivers predictable system-level integration and straightforward BOM planning.

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