A3P400-FGG256

The A3P400-FGG256 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology packaged in a 256-LBGA footprint. It provides a mid-range logic density with 9,216 logic elements, 178 user I/Os and on-chip embedded memory suitable for commercial-grade designs.

This device targets commercial applications that require a balance of logic capacity, I/O count and low-profile surface-mount packaging. Key electrical and environmental parameters include a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  9,216 logic elements (cells) delivering approximately 400,000 gates for mid-range programmable logic integration.
• Embedded Memory  Approximately 0.055 Mbits of on-chip RAM (55,296 bits) for buffering, small data storage and local state retention.
• I/O Capacity  178 user I/O pins to support parallel interfaces, control signals and mixed I/O requirements.
• Package and Mounting  256-LBGA package; supplier device package listed as 256-FPBGA (17×17), surface-mount mounting for compact PCB integration.
• Power  Nominal supply voltage specified from 1.425 V to 1.575 V to match system power rails within the given range.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• I/O-intensive control and interface  Use the 178 I/O pins for driving parallel interfaces, sensor arrays and mixed-signal control lines in commercial systems.
• Mid-range logic consolidation  Combine multiple glue-logic and control functions into the FPGA using its 9,216 logic elements to reduce component count.
• Local data buffering  Utilize the approximately 0.055 Mbits of on-chip RAM for small FIFO buffering and temporary data storage close to logic.

Unique Advantages

• Balanced logic density: 9,216 logic elements and ~400,000 gates provide a practical compromise between capacity and board-space efficiency for commercial designs.
• High I/O count: 178 user I/Os simplify system-level interfacing and reduce the need for external expanders or multiplexers.
• Compact, surface-mount packaging: 256-LBGA / 256-FPBGA (17×17) footprint enables high-density PCB layouts and reliable soldered mounting.
• Defined power envelope: Narrow supply voltage range (1.425 V to 1.575 V) helps with predictable power delivery and regulation planning.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product use.

Why Choose A3P400-FGG256?

The A3P400-FGG256 offers a practical mix of logic resources, I/O capacity and embedded memory in a compact 256-LBGA package, making it well suited to commercial designs that require moderate programmable logic integration without oversized form factors. Its clear electrical and thermal specifications simplify system-level power and thermal design decisions.

From Microchip Technology, this ProASIC3 device provides a commercially graded, RoHS-compliant FPGA option for engineers looking to consolidate control, interfacing and buffering tasks into a single programmable component.

Request a quote or submit an inquiry to receive pricing and availability information for the A3P400-FGG256.