A3P400-FGG256I

The A3P400-FGG256I is a ProASIC3 FPGA from Microchip Technology offering a mid-density, industrial-grade programmable logic solution. It integrates 9,216 logic elements, approximately 55 Kbits of on-chip RAM, and 178 I/Os in a compact 256-ball BGA package for embedded designs requiring configurable logic and a robust operating range.

With a supply range of 1.425 V to 1.575 V and an operating temperature span of -40°C to 100°C, this device is tailored for industrial applications where a combination of I/O capacity, logic density, and temperature tolerance are required.

Key Features

• Core Logic  9,216 logic elements provide configurable computational resources suitable for mid-range logic integration and custom digital functions.
• Embedded Memory  Approximately 55 Kbits (55,296 bits) of on-chip RAM for local buffering, state storage, and small data structures.
• I/O Capacity  178 general-purpose I/Os enable broad connectivity to peripherals, sensors, and external devices within a single package.
• Gate Count  Approximately 400,000 logic gates to support complex combinational and sequential designs.
• Power  Supported core supply voltage range of 1.425 V to 1.575 V to match system power domains and design requirements.
• Package & Mounting  Available in a 256-LBGA (supplier device package: 256-FPBGA, 17×17) surface-mount package for compact PCB integration.
• Temperature & Grade  Industrial-grade device rated for operation from -40°C to 100°C, addressing temperature demands of industrial environments.
• Regulatory Compliance  RoHS compliant, supporting environmentally driven design and manufacturing requirements.

Typical Applications

• Industrial Control  Implement custom control logic, I/O aggregation, and protocol handling in factory automation and process-control equipment using the device's industrial temperature range and 178 I/Os.
• Communications Equipment  Use the FPGA for interface bridging, packet manipulation, or custom protocol logic where moderate logic density and multiple I/Os are required.
• Instrumentation & Test  Deploy the device for data acquisition front-ends, signal conditioning control, and custom timing/state machines utilizing on-chip RAM and logic resources.
• Embedded Systems  Integrate as a configurable companion FPGA to handle glue logic, user interfaces, or peripheral expansion in compact, surface-mount applications.

Unique Advantages

• Balanced Mid-Range Logic Density: 9,216 logic elements and ~400,000 gates provide a balance between capacity and footprint for many embedded and industrial designs.
• Generous I/O Count: 178 I/Os enable consolidation of multiple interfaces and sensors into a single device, reducing board-level complexity.
• Industrial Temperature Support: Rated from -40°C to 100°C to meet industrial environment requirements without additional temperature qualification steps.
• Compact BGA Packaging: 256-LBGA (256-FPBGA, 17×17) delivers a small board footprint with high pin density for space-constrained designs.
• Controlled Power Range: Defined supply range (1.425 V to 1.575 V) simplifies power-system planning and ensures predictable device operation.
• RoHS Compliant: Meets RoHS requirements to support environmentally conscious manufacturing and distribution.

Why Choose A3P400-FGG256I?

The A3P400-FGG256I positions itself as a practical industrial-grade FPGA option for engineers who need a mid-density, configurable logic device with substantial I/O and on-chip RAM. Its combination of 9,216 logic elements, approximately 55 Kbits of RAM, 178 I/Os, and a 256-LBGA package supports a wide range of embedded and industrial designs.

Backed by Microchip Technology, this device is suited to teams developing control systems, communication interfaces, and compact embedded platforms that require predictable supply voltage requirements and extended operating temperatures.

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