A3P400-PQG208I

The A3P400-PQG208I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology in a 208-BFQFP surface-mount package. It provides 9,216 logic elements, approximately 55,296 bits of on-chip RAM, and 151 I/O pins for custom digital logic and interfacing.

With an operating supply range of 1.425 V to 1.575 V and an industrial temperature rating of −40°C to 100°C, this device is aimed at embedded and industrial applications that require moderate logic capacity and reliable operation across a wide temperature range.

Key Features

• Logic Capacity  9,216 logic elements (cells) delivering an aggregate equivalent of 400,000 gates for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 55,296 bits of on-chip RAM to support buffering, small data stores, and state machines.
• I/O Resources  151 user I/O pins suitable for interfacing with peripherals, sensors, and external logic.
• Power Supply  Core operates from a defined supply window of 1.425 V to 1.575 V to guide power-supply design and sequencing.
• Package and Mounting  208-BFQFP (supplier device package: 208-PQFP 28×28) in a surface-mount form factor for PCB integration.
• Temperature and Grade  Industrial-grade device specified for operation from −40°C to 100°C.
• Regulatory Compliance  RoHS compliant for environmental and assembly considerations.

Typical Applications

• Industrial Control  Implement custom control logic and I/O aggregation for factory automation and process control where an industrial temperature range is required.
• Embedded System Integration  Provide glue logic, custom peripherals, and interface bridging in embedded products using the available logic elements and 151 I/Os.
• Communications and Protocol Handling  Offload protocol processing and signaling tasks where on-chip RAM and flexible I/O are needed for buffering and timing.
• Test and Measurement  Build customized data acquisition front-ends and preprocessing functions that benefit from on-chip logic and memory in a compact package.

Unique Advantages

• Balanced Logic and Memory  Combines 9,216 logic elements with approximately 55,296 bits of embedded RAM to support both combinational and small-state designs.
• Substantial I/O Count  151 I/Os enable flexible interfacing to sensors, buses, and peripherals without extensive external glue components.
• Industrial Temperature Range  Rated from −40°C to 100°C to support deployments in temperature-challenging environments.
• Compact Surface-Mount Package  208-BFQFP (28×28 PQFP) provides a standardized footprint for PCB assembly while keeping component density manageable.
• Defined Core Supply Window  Operates within a specified 1.425 V to 1.575 V supply range to assist predictable power-system design.
• RoHS Compliance  Environmentally compliant for lead-free manufacturing processes.

Why Choose A3P400-PQG208I?

The A3P400-PQG208I delivers a combination of moderate logic density, on-chip RAM, and a substantial I/O count in a 208-BFQFP surface-mount package. Its industrial temperature rating and defined supply range make it appropriate for embedded and industrial designs that require reliable operation across a wide temperature range.

This part is suitable for engineers and procurement teams seeking an FPGA solution that balances logic resources, I/O capability, and standard packaging for integration into production assemblies.

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