A3P600-1FG256I

IC FPGA 177 I/O 256FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 177 110592 256-LBGA

Quantity 1,092 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O177Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of A3P600-1FG256I – ProASIC3 Field Programmable Gate Array (FPGA) IC 177 110592 256-LBGA

The A3P600-1FG256I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology provided in a 256-LBGA surface-mount package. It delivers a mid-range integration point with 13,824 logic elements, approximately 110,592 bits of on-chip RAM, and 177 user I/O connections for configurable digital designs.

Designed and graded for industrial use, this device operates over a wide voltage supply window and an extended temperature range, making it suitable for applications that require configurable logic in demanding environments.

Key Features

  • Core Logic  13,824 logic elements providing a total of 600,000 gates for implementing custom digital functions and moderate-complexity logic designs.
  • On-chip Memory  110,592 total RAM bits (approximately 0.11 Mbits) of embedded memory to support buffering, state machines, and local data storage.
  • I/O Capacity  177 user I/O pins to interface with external peripherals, sensors, and system buses.
  • Package & Mounting  256-LBGA in a 256-FPBGA (17×17) footprint, supplied as a surface-mount device to fit compact board layouts.
  • Voltage Supply  Operates from a nominal 1.425 V to 1.575 V supply, suitable for designs targeting this core-voltage range.
  • Industrial Temperature Rating  Specified to operate from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Environmental Compliance  RoHS compliant to meet standard environmental and material restrictions.

Unique Advantages

  • Balanced integration: Combines 13,824 logic elements and 110,592 bits of embedded RAM to support mid-range programmable logic tasks without external FPGA fabrics.
  • Robust I/O count: With 177 I/O pins available, the device supports dense interfacing requirements in compact packages.
  • Industrial-capable thermal range: The −40 °C to 100 °C operating range enables use in industrial systems where extended temperature tolerance is required.
  • Compact surface-mount package: The 256-LBGA (17×17) FPBGA package supports high-density PCB designs while keeping a standardized footprint.
  • Compliance-ready: RoHS compliance simplifies regulatory considerations for environmentally conscious designs.
  • Precise core voltage specification: The 1.425 V to 1.575 V supply window provides clear requirements for power delivery and system design.

Why Choose A3P600-1FG256I?

The A3P600-1FG256I positions itself as a mid-range programmable logic solution that combines a substantial logic element count, embedded RAM, and a high I/O count in a compact 256-LBGA package. Its industrial grade and extended operating temperature range make it appropriate for projects that require reliable configurability under challenging environmental conditions.

This FPGA is well suited to designers and procurement teams seeking a verifiable, RoHS-compliant device with clear electrical and thermal specifications, offering long-term value through a balance of integration, predictable supply-voltage requirements, and package-level density.

Request a quote or submit an inquiry to receive pricing and availability information for the A3P600-1FG256I.

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