A3P600-1FGG144

The A3P600-1FGG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a combination of programmable logic, on-chip memory and I/O resources in a compact 144-LBGA package targeted for commercial-grade applications.

With 13,824 logic elements and approximately 0.11 Mbits of embedded memory, this FPGA is suited for designs that require moderate logic density, multiple I/O signals and low-voltage core operation within a commercial temperature range.

Key Features

• Logic Capacity  13,824 logic elements (13824) providing a building block for custom digital functions and combinational/sequential logic implementation.
• On-Chip Memory  Total RAM of 110,592 bits (approximately 0.11 Mbits) for embedded storage and buffering in logic designs.
• I/O Resources  97 user I/O pins to interface with peripherals, sensors and other system components.
• Gate Equivalent  Approximately 600,000 gates to convey overall device complexity and mapping expectations.
• Power Supply  Core voltage range of 1.425 V to 1.575 V for low-voltage operation and compatibility with corresponding power management designs.
• Package and Mounting  144-LBGA (144-FPBGA, 13×13) surface-mount package for compact PCB integration and high-density board layouts.
• Commercial Grade Temperature  Operating temperature range of 0 °C to 85 °C suitable for commercial electronic systems.
• RoHS Compliant  Meets RoHS requirements for reduced hazardous substances in manufacturing and disposal.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, protocol handling or glue logic within commercial equipment where moderate logic density and multiple I/Os are required.
• Interface and I/O Expansion  Provide programmable interfacing, signal routing and timing for systems that need flexible I/O mapping and signal conditioning.
• Prototyping and Development  Use as a development platform for evaluating logic partitioning and timing before transitioning to production hardware in commercial product lines.

Unique Advantages

• Significant Logic Resources: 13,824 logic elements and ~600k gates enable implementation of substantial custom digital functions without external ASIC development.
• Embedded Memory On-Board: 110,592 bits of RAM (approximately 0.11 Mbits) provide local storage for buffering, state machines and small data tables.
• Flexible I/O Count: 97 I/O pins support a variety of peripheral interfaces and enable dense connectivity on compact boards.
• Compact, Surface-Mount Package: 144-LBGA (13×13) allows for space-efficient PCB design and reliable assembly using standard surface-mount processes.
• Commercial Temperature Rating: Rated 0 °C to 85 °C to match typical commercial application environments.
• RoHS Compliance: Supports environmentally conscious designs and regulatory requirements for many global markets.

Why Choose A3P600-1FGG144?

The A3P600-1FGG144 positions itself as a commercially graded ProASIC3 FPGA that balances logic capacity, embedded memory and I/O in a small 144-LBGA footprint. Its combination of 13,824 logic elements, approximately 110,592 bits of RAM and 97 I/O pins makes it appropriate for engineers designing commercial embedded systems that require programmable digital logic with moderate resource needs.

Backed by Microchip Technology and provided in a RoHS-compliant, surface-mount package with a defined core voltage range and commercial operating temperature, this FPGA offers a pragmatic option for teams seeking integration, predictable supply requirements and straightforward PCB implementation.

Request a quote or submit an inquiry to receive pricing and availability information for the A3P600-1FGG144 and to discuss how it can fit into your next commercial FPGA design.