A3P600-1FGG256I

The A3P600-1FGG256I is a ProASIC3 family Field Programmable Gate Array from Microchip Technology, delivered in a 256-LBGA package. It provides a balance of logic capacity, embedded memory and I/O density suitable for industrial-grade FPGA designs.

Key device attributes include 13,824 logic elements, approximately 0.11 Mbits of embedded memory, 177 I/Os and a supply voltage range of 1.425 V to 1.575 V, along with an industrial operating temperature range of –40 °C to 100 °C.

Key Features

• Core Capacity  600,000 gates and 13,824 logic elements provide a mid-range programmable fabric for custom logic integration and system partitioning.
• On-Chip Memory  Approximately 0.11 Mbits of embedded RAM for data buffering, small lookup tables and state storage within the device.
• I/O Density  177 general-purpose I/Os support complex interfacing and connectivity requirements for multi-channel systems.
• Power  Single supply operating range from 1.425 V to 1.575 V for core power compatibility with platform designs requiring precise supply rails.
• Package and Mounting  256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Range  Rated for operation from –40 °C to 100 °C, supporting deployment in industrial environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control Systems  Use the device’s industrial grade temperature range and plentiful I/Os for motor control interfaces, PLC functions and automation logic.
• Communications and Networking  Leverage the device’s logic capacity and I/O count for packet handling, protocol bridging and interface conversion tasks.
• Instrumentation and Test Equipment  Implement custom signal processing blocks and timing-critical logic while using embedded RAM for buffering measurement data.
• Embedded System Acceleration  Offload compute-intensive tasks to programmable logic to reduce system BOM and consolidate functions on a single FPGA.

Unique Advantages

• High Integration Density: 13,824 logic elements and 600,000 gates enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Significant I/O Count: 177 I/Os provide flexibility for multi-channel interfaces, sensor arrays or mixed-signal interconnects without external multiplexing.
• Industrial Reliability: Operation from –40 °C to 100 °C and an industrial grade designation support deployment in demanding environmental conditions.
• Compact Surface-Mount Package: 256-LBGA (17×17) offers a small footprint for space-constrained designs while retaining ample signal access.
• Regulatory Environmentally Compliant: RoHS compliance aligns with common environmental requirements for modern electronics manufacturing.

Why Choose A3P600-1FGG256I?

The A3P600-1FGG256I positions itself as a versatile, industrial-grade FPGA option that balances logic capacity, embedded memory and a high count of I/Os in a compact 256-LBGA package. Its specified supply range and extended operating temperature make it suitable for engineers building reliable, integrated systems for industrial and embedded applications.

Design teams looking to reduce component count, consolidate discrete logic and support robust environmental conditions will find this device a practical choice for mid-range programmable logic requirements, backed by Microchip Technology's ProASIC3 family credentials.

Request a quote or submit an inquiry to obtain pricing and availability for the A3P600-1FGG256I and to discuss how it fits your next design.