A3P600-1PQ208I

The A3P600-1PQ208I is a ProASIC3 FPGA from Microchip Technology, supplied in a 208-BFQFP surface-mount package. It provides a balance of logic density, I/O capability and on-chip memory for industrial embedded designs.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 154 I/O pins, this device targets applications that require mid-range programmable logic capacity within an industrial temperature range and a narrow core voltage window.

Key Features

• Logic Capacity — 13,824 logic elements (13824), providing support for complex logic implementations and medium-scale integration.
• Gate Count — 600,000 gates to characterize the device’s overall logic resource scale for design planning.
• Embedded Memory — Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for data buffering, small lookup tables and state storage.
• I/O Resources — 154 I/O pins to support a broad set of external interfaces and peripheral connectivity.
• Power — Core voltage supply range of 1.425 V to 1.575 V, enabling designs that require a defined low-voltage core rail.
• Package and Mounting — 208-BFQFP surface-mount package; supplier device package listed as 208-PQFP (28x28), suitable for board-level assembly.
• Temperature Range — Industrial operating range from -40°C to 100°C for deployment in demanding environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Implement control logic, I/O aggregation and protocol handling in systems that require industrial temperature capability.
• Protocol Bridging and Interface Consolidation — Use the device’s 154 I/O pins and logic elements to consolidate multiple serial or parallel interfaces into a single programmable solution.
• Embedded System Prototyping — Mid-range logic density and on-chip RAM make the device suitable for prototyping and validating custom digital functions before production.
• Instrumentation and Test Equipment — Combine moderate logic capacity and on-chip memory for timing, measurement control and data collection tasks in industrial instrumentation.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements paired with approximately 0.11 Mbits of RAM enable efficient implementation of control logic and small data buffers without external memory.
• High I/O Count: 154 I/O pins reduce the need for external I/O expanders when interfacing to sensors, actuators and peripherals.
• Industrial Reliability: Rated for -40°C to 100°C operation, supporting deployments in temperature-challenging industrial environments.
• Compact Surface-Mount Package: 208-BFQFP surface-mount format simplifies PCB layout for space-constrained designs while providing a full complement of pins.
• Defined Core Voltage: Narrow supply range (1.425 V–1.575 V) assists in predictable power design and voltage rail planning.
• RoHS Compliant: Meets RoHS requirements for environmental compliance in manufacturing and procurement.

Why Choose A3P600-1PQ208I?

The A3P600-1PQ208I delivers a mid-range ProASIC3 FPGA configuration tailored for industrial embedded projects that need a pragmatic mix of logic density, on-chip memory and a substantial I/O complement. Its industrial temperature rating and surface-mount 208-BFQFP package make it a suitable choice for ruggedized equipment and production systems where predictable electrical and thermal behavior matters.

This device is well suited to engineers designing control systems, interface aggregators or instrumentation who require a Microchip FPGA with clearly stated logic, memory, I/O and power characteristics—facilitating component selection, BOM reduction and reliable long-term operation.

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