A3P600-1PQG208

The A3P600-1PQG208 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides reconfigurable logic with 13,824 logic elements and embedded RAM totaling 110,592 bits to implement custom digital functions.

Designed for surface-mount assembly in a 208-BFQFP package (supplier package: 208-PQFP, 28×28), the device operates across a 1.425 V to 1.575 V supply range and is rated for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Logic Capacity — 13,824 logic elements provide the programmable resources needed for mid-density digital designs.
• Embedded Memory — Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for buffering, state storage, and small embedded data structures.
• I/O Count — 154 user I/O pins to interface with peripheral devices, sensors, and external logic.
• Gate Equivalency — Approximately 600,000 gates for system-level logic integration and glue logic functions.
• Power — Nominal core supply range of 1.425 V to 1.575 V to match targeted system power rails.
• Package & Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) for surface-mount PCB assembly.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant for regulatory alignment.

Typical Applications

• Embedded logic prototyping — Use the device’s 13,824 logic elements and 154 I/O to implement and validate custom digital blocks and interfaces during development.
• Interface bridging and glue logic — Match or translate signals between subsystems using the available I/O and programmable logic resources.
• Control and sequencing — Implement control state machines and sequencing logic leveraging on-chip RAM for small buffers and state storage.

Unique Advantages

• Balanced logic and memory — Combines 13,824 logic elements with approximately 0.11 Mbits of embedded RAM to support both combinational and small-scale sequential designs.
• Generous I/O density — 154 I/O pins provide flexibility for interfacing with multiple peripherals and external devices without additional I/O expanders.
• Compact, surface-mount package — 208-BFQFP (208-PQFP, 28×28) supports compact PCB layouts while maintaining accessibility to many I/O signals.
• Low-voltage core operation — Core supply range of 1.425 V to 1.575 V aligns with contemporary low-voltage digital systems.
• Regulatory compliance — RoHS compliance supports environmentally responsible manufacturing practices.

Why Choose A3P600-1PQG208?

The A3P600-1PQG208 delivers a mid-density programmable logic solution that pairs substantial logic resources with embedded memory and a high I/O count in a compact surface-mount package. Its commercial temperature rating and low-voltage core operation make it suitable for a wide range of commercial electronic designs requiring configurable logic and interface flexibility.

Produced by Microchip Technology, this ProASIC3 device is positioned for designers who need reconfigurable hardware to consolidate glue logic, implement custom state machines, or prototype digital functions while keeping board area and component count under control.

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