A3P600-2FG256

The A3P600-2FG256 is a ProASIC3 field programmable gate array (FPGA) manufactured by Microchip Technology. It integrates 13,824 logic elements, approximately 110,592 bits (≈0.111 Mbits) of embedded memory, and 177 user I/O in a 256-LBGA package.

Targeted for commercial-grade designs, this FPGA provides a balance of on-chip memory, I/O count, and logic capacity for applications that require programmable logic in a compact surface-mount form factor.

Key Features

• Logic Capacity  13,824 logic elements provide programmable combinational and sequential resources for implementing custom digital functions.
• Embedded Memory  Approximately 110,592 bits (≈0.111 Mbits) of on-chip RAM to support buffering, small lookup tables, and state storage.
• I/O and Gate Count  177 user I/O pins and a reported 600,000 gates to support moderate connectivity and logic complexity.
• Package and Mounting  256-LBGA package (supplier device package: 256-FPBGA 17×17) in a surface-mount configuration for compact PCB integration.
• Power Supply  Operating core voltage range of 1.425 V to 1.575 V for device power planning.
• Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Implement custom logic, control functions, and interface glue logic using the device’s 13,824 logic elements and 177 I/O.
• Industrial Control (Commercial Grade)  Use in non-automotive commercial control equipment where commercial temperature range and programmable logic are required.
• Interface and Protocol Bridging  Leverage the available I/O and on-chip memory to manage protocol translation and signal conditioning tasks.

Unique Advantages

• Balanced Logic and Memory  A combination of 13,824 logic elements and approximately 110,592 bits of embedded RAM supports a wide range of mid-density designs.
• Generous I/O Count  177 user I/O pins enable multiple peripheral connections and flexible board-level routing.
• Compact LBGA Packaging  256-LBGA (256-FPBGA 17×17) keeps board footprint small while providing high pin density.
• Commercial Temperature Suitability  Rated for 0 °C to 85 °C for standard commercial-environment deployments.
• RoHS Compliant  Meets common lead-free manufacturing requirements for commercial electronics production.

Why Choose A3P600-2FG256?

The A3P600-2FG256 positions itself as a commercially graded ProASIC3 FPGA that delivers moderate logic density, embedded memory, and a high I/O count in a compact 256-LBGA package. It is suited to designers who need programmable logic and memory resources for commercial embedded applications while maintaining a small PCB footprint.

With explicit voltage and temperature specifications and RoHS compliance, this device provides clear implementation parameters for procurement and system integration in commercial projects backed by Microchip Technology manufacturing and documentation.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the A3P600-2FG256.