A3P600-2FG256I

The A3P600-2FG256I is a ProASIC3 family FPGA from Microchip Technology, providing a programmable logic solution with substantial logic density and I/O capability in a compact BGA package. It is designed for industrial applications that require configurable digital logic, a moderate amount of embedded memory, and wide operating temperature support.

With 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, and 177 I/Os, this device targets designers who need a robust, industrial-grade programmable device that integrates high I/O count and significant gate density in a surface-mount 256-ball BGA footprint.

Key Features

• Logic Capacity — 13,824 logic elements (cells) delivering a total of 600,000 gates for implementing complex combinational and sequential logic.
• Embedded Memory — 110,592 total RAM bits, approximately 0.11 Mbits of on-chip memory for buffering, state storage, and small data structures.
• I/O and Connectivity — 177 user I/Os to support substantial peripheral interfacing and external device connections in mixed-signal or digital systems.
• Package and Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board layouts.
• Power — Voltage supply range of 1.425 V to 1.575 V to match system core rail requirements.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environment demands.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing.

Typical Applications

• Industrial Control — Implement custom control logic, I/O aggregation, and glue logic for factory automation and machine control systems that require industrial temperature operation.
• Embedded System Integration — Use as programmable glue between processors, peripherals, and sensors where moderate logic capacity and on-chip RAM are needed.
• Data Acquisition and Signal Conditioning — Provide configurable data-paths, counters, and interface logic for instrumentation and data-collection modules.

Unique Advantages

• High Logic Density: 13,824 logic elements and 600,000 gates enable implementation of sizable custom logic functions without external ASICs.
• Substantial I/O Count: 177 I/Os allow flexible interfacing to sensors, controllers, and communication peripherals, reducing the need for external I/O expanders.
• Compact BGA Footprint: 256-LBGA / 256-FPBGA (17×17) package supports space-constrained PCBs while maintaining a high pin count.
• Industrial Qualification: Specified for −40 °C to 100 °C operation, making it suitable for harsh or factory-floor environments.
• Controlled Core Voltage: Narrow supply range (1.425 V–1.575 V) for predictable power design and stable core operation.
• Regulatory Compliance: RoHS compliance helps meet lead-free manufacturing requirements.

Why Choose A3P600-2FG256I?

The A3P600-2FG256I delivers a balanced mix of logic capacity, embedded memory, and high I/O count in an industrial-temperature-rated, surface-mount BGA package. It is well suited for engineers designing industrial control, embedded integration, and data-acquisition systems that require programmable logic with reliable thermal performance.

Backed by Microchip Technology’s ProASIC3 product family, this device provides a compact, programmable option for teams seeking durable, RoHS-compliant hardware with clearly defined electrical and mechanical parameters. Refer to the ProASIC3 family datasheet for full electrical and timing specifications when validating designs.

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