A3P600-2FGG144

The A3P600-2FGG144 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology, offered in a 144-LBGA package. It provides a programmable logic fabric with a balanced combination of logic capacity, on-chip memory and I/O for commercial embedded designs.

Designed for integration into systems that require configurable digital logic, the device targets applications where programmable logic, on-chip RAM and a moderate number of I/O are required within a compact surface-mount package.

Key Features

• Logic Capacity  Approximately 13,824 logic elements (cells) delivering up to 600,000 equivalent gates for implementing combinational and sequential logic functions.
• Embedded Memory  Contains 110,592 bits of on-chip RAM (approximately 0.11 Mbits) to support data buffering, state machines and small on-chip storage requirements.
• I/O  Provides 97 I/O pins to interface with external peripherals, sensors and digital interfaces in space-constrained designs.
• Power  Operates from a core supply range of 1.425 V to 1.575 V, enabling predictable power budgeting for the core logic.
• Package and Mounting  Supplied in a 144-LBGA (144-FPBGA, 13×13) package with surface-mount construction suitable for compact PCB layouts.
• Operating Range  Commercial grade device rated for 0 °C to 85 °C operation, appropriate for standard commercial environments.
• Compliance  RoHS compliant, supporting lead-free manufacturing processes and regulatory requirements for most commercial products.

Typical Applications

• Embedded Logic and Control  Implement custom state machines, control logic and glue functions where a compact programmable solution is required.
• Interface Bridging  Provide flexible I/O and protocol adaptation between subsystems using the device's configurable I/O and logic resources.
• Prototyping and Development Platforms  Serve as a programmable platform for validating digital designs and iterating on logic implementations before final integration.

Unique Advantages

• Balanced Logic and Memory:  13,824 logic elements paired with approximately 0.11 Mbits of on-chip RAM enables implementation of mid-complexity digital designs without external memory.
• Compact Package:  144-LBGA (13×13) package reduces PCB footprint while providing ample I/O for system integration.
• Predictable Power Envelope:  A defined core voltage range (1.425 V–1.575 V) simplifies power supply design and integration.
• Commercial Temperature Rating:  Qualified for 0 °C to 85 °C operation, making it suitable for standard commercial product environments.
• RoHS Compliance:  Complies with RoHS requirements to support lead-free manufacturing and regulatory needs.

Why Choose A3P600-2FGG144?

The A3P600-2FGG144 combines a practical logic element count, embedded RAM and a substantial I/O complement in a compact 144-LBGA package, making it well suited to commercial embedded designs that require programmable logic without large external components. Its defined supply and temperature specifications facilitate predictable system integration.

Backed by Microchip Technology, this ProASIC3 FPGA offers a scalable, surface-mount solution for engineers seeking a programmable building block for control logic, interface adaptation and prototyping in commercial applications.

If you would like pricing, availability or a formal quote for the A3P600-2FGG144, submit a request or contact sales to initiate a quote or request additional purchasing information.