A3P600-2FGG144I

The A3P600-2FGG144I is a ProASIC3 field programmable gate array (FPGA) IC offering a balanced combination of programmable logic, embedded memory, and I/O in a compact 144-LBGA package. It delivers 13,824 logic elements and 110,592 bits of on-chip RAM to support custom digital logic implementations.

Designed for surface-mount PCB assembly and rated for industrial use, this device is appropriate for designs that require a mid-range logic density, a defined I/O count, and an extended operating temperature range.

Key Features

• Programmable Logic Core 13,824 logic elements supporting up to 600,000 gates for implementing custom digital functions and control logic.
• Embedded Memory 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for data storage, buffering, and state machines.
• I/O Capacity 97 available I/Os to interface with peripherals, sensors, and external logic.
• Power Supply Operates from a supply range of 1.425 V to 1.575 V to match target system power rails.
• Package & Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact board layouts.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for applications requiring extended temperature range.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom Digital Logic — Implement state machines, protocol handlers, and bespoke logic functions using the on-chip logic elements and RAM.
• I/O Expansion and Bridging — Use the 97 I/Os to connect and translate between multiple peripheral interfaces or to expand system I/O capacity.
• Prototyping and Low-Volume Production — Reprogrammable logic and a compact LBGA footprint make the device suitable for development platforms and smaller production runs.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements provide a mid-range resource set for a wide variety of custom digital designs without oversizing the solution.
• On-Chip Memory: 110,592 bits of embedded RAM reduce reliance on external memory for buffering and state storage, simplifying board design.
• Generous I/O Count: Ninety-seven I/Os allow flexible connectivity to sensors, peripherals, and external logic networks.
• Compact, Surface-Mount Package: 144-LBGA (144-FPBGA, 13×13) supports high-density PCB layouts while maintaining a standardized mount style.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in environments requiring extended thermal tolerance.
• Regulatory Compliance: RoHS compliance supports use in assemblies that require lead-free components.

Why Choose A3P600-2FGG144I?

The A3P600-2FGG144I offers a practical combination of logic resources, embedded memory, and I/O in a compact LBGA package with an industrial temperature rating. It is well suited to engineers seeking a reprogrammable solution that balances integration and board-level density for mid-range digital designs.

This device provides predictable on-chip resources and clear electrical and thermal limits (supply range and operating temperature), making it straightforward to specify in systems where those parameters matter for long-term deployment.

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