A3P600-2FGG484I

The A3P600-2FGG484I is a ProASIC3 field programmable gate array from Microchip Technology providing a balance of logic density, I/O capacity, and embedded memory for system-level digital logic integration. It offers 13,824 logic elements, approximately 0.11 Mbits of embedded RAM, and 235 user I/O pins in a 484-BGA package.

Designed for industrial-grade operation, the device supports a supply voltage range of 1.425 V to 1.575 V and an ambient operating temperature range of −40 °C to 100 °C, packaged for surface-mount assembly.

Key Features

• Logic Capacity  13,824 logic elements (logic cells) supporting up to 600,000 gates for medium-density integration of custom logic functions.
• Embedded Memory  Approximately 110,592 bits of on-chip RAM to support buffering, state storage, and small lookup tables within the FPGA fabric.
• I/O Resources  235 user I/O pins provide flexible interfacing for peripherals, sensors, and digital buses.
• Package and Mounting  484-ball BGA footprint (supplier package 484-FPBGA, 23 × 23) optimized for surface-mount PCB assembly while delivering a high I/O-to-footprint ratio.
• Power  Operates from a 1.425 V to 1.575 V core supply range to match system power-rail design requirements.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Unique Advantages

• Balanced Logic and Memory: The combination of 13,824 logic elements and ~0.11 Mbits of embedded RAM enables integration of complex control and data-path functions without external SRAM.
• High I/O Count in a Compact Package: With 235 I/Os in a 484-BGA (23 × 23) footprint, the device supports dense interfacing while conserving PCB area.
• Industrial Reliability: Rated for −40 °C to 100 °C and industrial grade designation, suitable for temperature-demanding deployments.
• Predictable Power Envelope: A defined core supply range (1.425 V–1.575 V) simplifies power-rail design and integration into regulated systems.
• Surface-Mount Ready: Supplied in a 484-FPBGA package for standard surface-mount assembly processes.
• Compliance-Minded Design: RoHS compliance supports manufacturing and environmental requirements.

Why Choose A3P600-2FGG484I?

The A3P600-2FGG484I positions itself as a practical mid-density FPGA option that brings together substantial logic resources, embedded RAM, and a high pin count in an industrial-grade, surface-mount BGA package. Its specified supply voltage range and operating temperature make it suitable for designs that require consistent electrical characteristics and extended environmental tolerance.

This device is well suited for engineers and procurement teams seeking a verified FPGA building block for systems that need integrated logic, ample I/O, and compact packaging while maintaining regulatory compliance for manufacturing.

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