A3P600-2PQ208I

The A3P600-2PQ208I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology. It provides 13,824 logic elements and approximately 0.11 Mbits of embedded memory in a 208-BFQFP surface-mount package, aimed at industrial applications requiring configurable digital logic and I/O density.

With 154 user I/O pins, support for a 1.425 V to 1.575 V core supply and an operating temperature range of −40 °C to 100 °C, this device is suited for industrial environments where on-board integration and temperature resilience are important.

Key Features

• Logic Capacity — 13,824 logic elements (logic cells) providing programmable fabric to implement custom digital functions and state machines.
• Embedded Memory — 110,592 total RAM bits, approximately 0.11 Mbits of on-chip RAM to support FIFOs, small buffers and local data storage.
• I/O Density — 154 user I/O pins for interfacing with external peripherals, sensors, and digital buses.
• Gate Count — 600,000 gates to quantify overall device complexity for system partitioning and resource planning.
• Power — Core voltage supply range of 1.425 V to 1.575 V to match system power domains and design constraints.
• Package & Mounting — 208-BFQFP (supplier package: 208-PQFP, 28 × 28) in a surface-mount form factor for PCB assembly and space-efficient layouts.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial-grade thermal requirements.
• RoHS Compliance — Lead-free and RoHS compliant for regulatory and environmental conformance.

Typical Applications

• Industrial Control: Implement custom control logic, I/O aggregation and interface bridging in factory automation and process control systems where industrial temperature range is required.
• Embedded Systems: Provide programmable glue logic, peripheral interfaces and data path acceleration in embedded products with moderate logic and memory requirements.
• Communications and Protocol Bridging: Support protocol conversion and I/O-rich intermediary functions between differing digital interfaces using the device's 154 I/Os.

Unique Advantages

• Balanced Integration: Combines 13,824 logic elements with on-chip RAM to consolidate logic and memory functions and reduce external components.
• I/O-Heavy Packages: 154 user I/Os enable flexible connectivity for multi-sensor, multi-bus or multi-peripheral designs without needing external expanders.
• Industrial Reliability: Specified for −40 °C to 100 °C operation and supplied in a robust surface-mount 208-BFQFP package for demanding operating environments.
• Clear Power Domain: Defined core voltage range (1.425 V to 1.575 V) simplifies power supply design and integration with existing system rails.
• Regulatory Compliance: RoHS-compliant construction supports environmental and manufacturing requirements.

Why Choose A3P600-2PQ208I?

The A3P600-2PQ208I sits within Microchip Technology’s ProASIC3 FPGA family and offers a practical balance of logic capacity, embedded memory and I/O count for industrial and embedded designs. Its gate count, logic elements and on-chip RAM allow designers to implement custom, integrated digital functions while minimizing external components.

This device is well-suited for engineering teams building industrial control, embedded interface or communications bridging solutions that require a surface-mount package, defined core voltage and an extended operating temperature range. Selecting this ProASIC3 part delivers scalability within Microchip’s FPGA family and the form-factor compatibility needed for production deployments.

Request a quote or submit an inquiry to receive pricing and availability for the A3P600-2PQ208I and to discuss how it fits your next design.