A3P600-2PQ208

The A3P600-2PQ208 is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology designed for mid-density programmable logic applications. It provides 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 154 user I/O pins in a 208-BFQFP package, offering a balanced mix of logic capacity and I/O for space-constrained board designs.

Designed for surface-mount assembly and commercial-grade operation, the device operates from a 1.425 V to 1.575 V core supply and across a 0 °C to 85 °C temperature range, making it suitable for a wide range of standard embedded and electronic applications.

Key Features

• Logic Capacity — 13,824 logic elements (cells) and approximately 600,000 gates provide mid-density programmable logic for custom digital functions.
• Embedded Memory — 110,592 total RAM bits (approximately 0.11 Mbits) available for buffering, state storage, and on-chip data handling.
• I/O — 154 user I/O pins to support multiple external interfaces and peripheral connections on a single device.
• Power and Operating Range — Core voltage supply specified from 1.425 V to 1.575 V; commercial operating temperature from 0 °C to 85 °C.
• Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) optimized for surface-mount PCB assembly where a mid‑pin-count footprint is required.
• Compliance — RoHS compliant for environmental regulatory alignment.

Typical Applications

• Custom Logic & Glue Logic — Implement protocol glue, timing control, and custom combinational/sequential logic using the device’s 13,824 logic elements and 154 I/Os.
• Interface Bridging — Bridge and translate between multiple on-board interfaces where moderate I/O count and embedded RAM are required.
• Embedded Control — Deploy in embedded control systems that need configurable logic and on-chip memory within a commercial temperature range.
• Prototyping and Small-Volume Production — Use the device for board-level prototypes and low- to mid-volume production runs that require a compact PQFP footprint.

Unique Advantages

• Balanced Logic and Memory: Combines 13,824 logic elements with approximately 0.11 Mbits of RAM to handle both control logic and moderate data buffering on-chip.
• Generous I/O Count: 154 user I/Os allow aggregation of multiple peripheral signals and interface functions without external glue components.
• Compact Package: 208-BFQFP / 208-PQFP (28×28) packaging supports dense PCB layouts while remaining compatible with standard surface-mount assembly.
• Predictable Power Envelope: Narrow core voltage range (1.425 V to 1.575 V) simplifies power-supply planning and regulation for stable operation.
• Regulatory Compliance: RoHS compliance supports environmentally conscious designs and supply-chain requirements.

Why Choose A3P600-2PQ208?

The A3P600-2PQ208 positions itself as a mid-density FPGA option for designers who require a mix of logic elements, on-chip RAM, and a substantial I/O count in a compact surface-mount package. With 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 154 I/Os, it suits designs that need configurable digital logic and interface consolidation within a commercial temperature envelope.

Manufactured by Microchip Technology, this ProASIC3 device provides a clear specification set for procurement and system integration, enabling engineers to match capacity, package, power, and environmental characteristics to their project requirements.

Request a quote for A3P600-2PQ208 today to receive pricing and availability details for your next design or production run.