A3P600-2PQG208

The A3P600-2PQG208 is a ProASIC3 family FPGA from Microchip Technology, presented in a 208-BFQFP surface-mount package. It delivers a balance of logic capacity, I/O count and on-chip memory for commercial embedded designs.

Key on-chip resources include 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and support for 154 I/O pins. The device operates from a 1.425 V to 1.575 V supply and is rated for commercial temperature use (0 °C to 85 °C). RoHS compliance is provided.

Key Features

• Core Logic Capacity 13,824 logic elements (approximate logic resources) and roughly 600,000 gates enable implementation of complex combinational and sequential logic functions within a single device.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM provide local storage for buffering, state machines, or small data tables without external memory.
• I/O Resources 154 available I/O pins support a wide range of signal interfacing and board-level connectivity requirements for commercial systems.
• Power Supply Core supply range of 1.425 V to 1.575 V defines the device's power requirements for integration into power delivery designs.
• Package and Mounting Supplied in a 208-BFQFP (supplier device package listed as 208-PQFP 28×28) surface-mount package suitable for compact PCBs and automated assembly.
• Operating Conditions and Compliance Commercial temperature rating of 0 °C to 85 °C and RoHS compliance for environmental regulatory alignment.

Typical Applications

• Commercial embedded systems — Implements custom logic, control functions, and glue logic in consumer or industrial-facing commercial products where commercial temperature range is acceptable.
• I/O-dense interfaces — Supports designs that require a high number of general-purpose I/Os for board-level signal aggregation and protocol bridging.
• On-board acceleration and glue logic — Provides local processing and interfacing capabilities using available logic elements and on-chip RAM to offload tasks from a main processor.
• Prototype and product evaluation — Suitable for evaluating logic architectures and verifying designs in the commercial product development cycle.

Unique Advantages

• High logic density: 13,824 logic elements and approximately 600,000 gates enable compact implementation of sizeable logic functions without multiple devices.
• Integrated on-chip memory: Approximately 0.11 Mbits of embedded RAM reduces reliance on external memory for small buffers and state storage.
• Generous I/O availability: 154 I/O pins provide flexibility for interfacing multiple peripherals, buses, and board-level connections.
• Compact surface-mount packaging: 208-BFQFP (208-PQFP, 28×28) package supports high-density PCB layouts and automated assembly workflows.
• Commercial-grade qualification: Rated for 0 °C to 85 °C and RoHS compliant, aligning with commercial product requirements and regulatory expectations.
• Clear power specification: Defined core supply range (1.425 V–1.575 V) simplifies power-supply planning and design integration.

Why Choose A3P600-2PQG208?

The A3P600-2PQG208 delivers a mix of logic capacity, embedded memory and I/O resources in a single commercial-grade FPGA package from Microchip Technology. Its combination of 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM and 154 I/Os makes it a practical choice for commercial embedded designs that require substantial programmable logic without resorting to multiple devices.

This device suits designers seeking a balanced FPGA solution for prototyping and product development where a defined core voltage range, surface-mount package, and RoHS compliance are required. It provides predictable integration characteristics for teams focused on commercial product schedules and board-level implementation.

Request a quote or submit a pricing inquiry today to discuss availability, lead times and volume pricing for the A3P600-2PQG208.