A3P600-FG144I

The A3P600-FG144I is a ProASIC3 field programmable gate array from Microchip Technology, offered in a 144-LBGA package. It delivers a balance of programmable logic capacity, embedded memory, and I/O density for industrial-grade embedded designs.

Targeted at applications that require up to 13,824 logic elements, approximately 600,000 gates and 97 I/O pins while operating across a wide industrial temperature range, this device is specified for constrained-voltage systems and surface-mount assembly.

Key Features

• Logic Capacity  13,824 logic elements providing programmable resource for custom digital logic and control functions.
• Gate Equivalent  Approximately 600,000 gates to describe overall logic complexity and integration potential.
• Embedded Memory  Approximately 0.11 Mbits of embedded memory (110,592 bits) for buffering, state storage, and small lookup tables.
• I/O Count  97 I/O pins to support multiple peripheral connections and interface requirements.
• Power  Single-core supply range of 1.425 V to 1.575 V for predictable core power rail design.
• Package & Mounting  144-LBGA package (supplier device package 144-FPBGA, 13×13 mm) designed for surface-mount assembly in compact board layouts.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C to meet temperature demands of industrial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Implements custom control logic and I/O handling where industrial temperature rating and a robust I/O count are required.
• Embedded System Integration  Provides programmable glue logic, protocol translation, and custom processing for compact embedded products using a 144-LBGA footprint.
• I/O Expansion and Interface Bridging  Serves as a configurable hub for aggregating signals or bridging between peripherals with its 97 available I/O pins.

Unique Advantages

• Balanced Logic and Memory  Combines 13,824 logic elements with approximately 0.11 Mbits of embedded memory to support a range of mid-scale logic functions without external RAM.
• Predictable Power Envelope  Narrow core supply range (1.425 V–1.575 V) simplifies power-supply design and core rail management.
• Industrial-Grade Operation  −40°C to 100°C operating range enables deployment in demanding industrial environments.
• Compact Surface-Mount Package  144-LBGA (144-FPBGA, 13×13 mm) supports high-density PCB designs while maintaining substantial I/O and logic resources.
• Regulatory Compliance  RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose A3P600-FG144I?

The A3P600-FG144I from Microchip Technology’s ProASIC3 family positions itself as a versatile, industrial-grade FPGA option that combines mid-scale logic resources, embedded memory, and a substantial I/O count in a compact LBGA package. Its specified gate count, logic element capacity, and operating temperature range make it well suited for industrial and embedded designs that require reliable programmable logic within a constrained board footprint.

Designers who need predictable power rails, surface-mount packaging, and RoHS compliance will find this device appropriate for applications demanding robustness and integration without excessive board area or external memory dependencies.

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