A3P600-FG484I

The A3P600-FG484I is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial applications. It provides 600,000 logic gates, 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 235 user I/O in a 484‑ball BGA package.

With a low-voltage supply range (1.425 V to 1.575 V), surface‑mount 484‑FPBGA (23×23) package, and an operating temperature range of −40 °C to 100 °C, this device targets embedded and industrial designs that require substantial logic capacity and a broad operating temperature window.

Key Features

• Core Capacity — 600,000 logic gates and 13,824 logic elements provide substantial on-chip programmable logic resources for complex designs.
• Embedded Memory — Approximately 0.11 Mbits of total on-chip RAM for buffering, small lookup tables, and register storage.
• I/O Count — 235 user I/O pins to support dense external interfacing and multiple peripheral connections.
• Power — Tight supply range of 1.425 V to 1.575 V for the device core.
• Package — 484‑BGA (supplier package: 484‑FPBGA, 23×23) in a surface‑mount form factor suitable for compact PCB designs.
• Temperature & Environmental — Industrial operating range from −40 °C to 100 °C and RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control — Use the extended −40 °C to 100 °C operating range and high logic density to implement control logic, state machines, and custom I/O in industrial environments.
• Embedded Systems — 600K gates and 13,824 logic elements enable offloading of application‑specific functions within embedded platforms that require moderate on‑chip memory and numerous I/O.
• Custom I/O Bridging — 235 I/O pins allow the FPGA to serve as a bridge or glue logic device between multiple peripherals and subsystems.
• Prototyping and Low‑to‑Mid Complexity IP Integration — The combination of gates, logic elements, and embedded RAM supports integration of bespoke IP blocks for product development and deployment.

Unique Advantages

• Significant Logic Density: 600,000 gates and 13,824 logic elements deliver the capacity to implement complex logic and custom functions without external glue logic.
• Generous I/O Count: 235 user I/O pins simplify board-level integration by accommodating multiple interfaces and peripherals directly.
• Industrial Temperature Rating: Certified operation from −40 °C to 100 °C supports deployment in industrial environments that demand temperature resilience.
• Compact BGA Packaging: 484‑FPBGA (23×23) surface‑mount package provides a dense footprint for space-constrained PCBs while maintaining robust connectivity.
• Regulatory Compatibility: RoHS compliance supports contemporary manufacturing and environmental requirements.
• Precision Supply Window: Narrow core voltage range (1.425 V–1.575 V) that enables predictable power design and integration.

Why Choose A3P600-FG484I?

The A3P600-FG484I combines substantial programmable logic capacity, a high I/O count, and an industrial temperature rating to serve embedded and industrial design needs. Its 484‑ball BGA package and surface‑mount mounting make it suitable for compact, production-ready PCBs where board space and environmental robustness are important.

Engineers selecting this device will find a balance of logic resources, on‑chip memory, and I/O breadth that addresses mid‑to‑higher complexity designs while meeting RoHS and industrial temperature requirements. The A3P600-FG484I is positioned for applications that require reliable, field‑programmable logic in demanding environments.

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