A3P600-FG256I

The A3P600-FG256I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology. It provides a mid-range logic capacity with integrated RAM and a substantial I/O count in a compact 256-LBGA package.

Designed for industrial applications, this device addresses embedded designs that require up to 177 user I/O, 13,824 logic elements, and an operating temperature range suitable for industrial environments.

Key Features

• Core Logic  Provides 13,824 logic elements (equivalent to 600,000 gates) to implement custom digital functions and control logic.
• On-Chip Memory  Includes 110,592 total RAM bits (approximately 0.11 Mbits) for embedded data storage and buffering.
• I/O Capability  Up to 177 user I/O pins to support a wide range of peripheral interfaces and system connections.
• Package & Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17 × 17) in a surface-mount form factor for compact board integration.
• Power  Specified supply voltage range from 1.425 V to 1.575 V for core operation.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory  RoHS-compliant manufacturing status to meet environmental requirements.

Typical Applications

• Industrial Control & Automation  Implement custom control logic, sensor interfacing, and I/O aggregation where industrial temperature operation and reliable I/O density are required.
• Embedded Processing  Offload application-specific processing and glue logic in embedded systems using the device’s logic elements and on-chip memory.
• Communications & Interface Bridging  Support protocol conversion and interface management with abundant I/O and moderate embedded memory for buffering.

Unique Advantages

• High Logic Density: 13,824 logic elements and 600,000 gates enable substantial custom logic integration without external discrete logic.
• Ample I/O Count: 177 user I/O pins facilitate direct connections to sensors, peripherals, and external devices, reducing the need for additional interface chips.
• Embedded Memory: 110,592 bits of on-chip RAM (≈0.11 Mbits) supports local data storage, buffering, and state retention within the FPGA.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and specified as industrial grade for deployment in harsher operating environments.
• Compact BGA Package: 256-LBGA (256-FPBGA, 17 × 17) reduces PCB footprint while providing dense pinout for complex designs.
• Standards Compliance: RoHS-compliant manufacturing aligns with environmental and materials requirements.

Why Choose A3P600-FG256I?

The A3P600-FG256I offers a balanced combination of logic capacity, I/O density, and embedded memory in a compact surface-mount BGA package. Backed by Microchip Technology, it is positioned for industrial embedded designs that require reliable operation across a wide temperature range and significant on-chip resources.

This device is well suited for engineers building control systems, interface bridges, and embedded processing functions who need a scalable FPGA platform with clear electrical and thermal specifications for long-term deployments.

Request a quote or submit a pricing inquiry to obtain availability details and volume pricing for the A3P600-FG256I. Our team can help with part selection and ordering information.