A3P600-FGG144

The A3P600-FGG144 is a ProASIC3 field programmable gate array from Microchip Technology. It provides 13,824 logic elements (13824 logic elements), approximately 110,592 bits of embedded memory, and up to 97 I/O pins in a 144-LBGA package.

Designed for commercial-grade applications, this surface-mount FPGA operates from a 1.425 V to 1.575 V supply and across an operating temperature range of 0 °C to 85 °C. It offers a mid-range logic capacity and on-chip resources for configurable digital designs.

Key Features

• Core Logic  13,824 logic elements providing a total gate count of 600,000 for combinational and sequential logic implementation.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for data buffering and state storage.
• I/O Capacity  Up to 97 input/output pins to support external interfacing and peripheral connections.
• Power Supply  Operates from a nominal supply range of 1.425 V to 1.575 V for core logic.
• Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA 13×13) in a surface-mount form factor to minimize PCB footprint.
• Operating Range  Commercial-grade device specified for operation from 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant, simplifying integration into compliant commercial products.

Typical Applications

• Commercial Embedded Systems — Use the A3P600-FGG144 for configurable logic and I/O aggregation in commercial electronic products where a mid-range FPGA is required.
• Control and Interface Functions — Leverage 97 I/Os and 13,824 logic elements to implement control logic, protocol bridging, and custom interfacing tasks.
• Prototyping and Low- to Mid-Volume Production — Surface-mount 144-LBGA packaging and moderate resource set make the device suitable for design validation and production runs in commercial applications.

Unique Advantages

• Balanced Logic and Memory — 13,824 logic elements combined with approximately 110,592 bits of RAM provides a practical mix of logic capacity and on-chip storage for many commercial designs.
• Ample I/O for Integration — Ninety-seven I/O pins enable aggregation of peripherals and external devices without additional interface chips in many use cases.
• Compact, Surface-Mount Package — 144-LBGA (13×13 FPBGA) reduces PCB area while maintaining robust connectivity for board-level assembly.
• Commercial Temperature Rating — Specified operation from 0 °C to 85 °C aligns with standard commercial product requirements.
• RoHS Compliant — Conforms to RoHS requirements for environmentally conscious product designs.

Why Choose A3P600-FGG144?

The A3P600-FGG144 positions itself as a commercially graded FPGA option offering a practical combination of 13,824 logic elements, roughly 0.11 Mbits of embedded RAM, and 97 I/Os in a 144-LBGA surface-mount package. Its supply voltage range and temperature rating make it suitable for a wide range of commercial electronic designs where moderate programmable logic capacity is required.

Engineers and procurement teams looking for a mid-range programmable-logic device from Microchip Technology will find the A3P600-FGG144 provides clearly specified resources and a compact package for integration into space-constrained PCBs.

Request a quote or submit a procurement inquiry today to receive pricing and availability for the A3P600-FGG144.