A3P600-FGG144I

The A3P600-FGG144I is a ProASIC3 field programmable gate array (FPGA) designed for industrial embedded applications that require reconfigurable digital logic. It provides a balance of logic capacity, on-chip memory, and I/O density in a compact 144-LBGA package for space-constrained designs.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 97 user I/O pins, this device is suited to control, interface and signal-processing tasks within an industrial temperature range and a defined core voltage window.

Key Features

• Logic Capacity  13,824 logic elements and approximately 600,000 gates for implementing custom digital functions and logic consolidation.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) to support buffering, state machines and small data tables.
• I/O Density  97 I/O pins to connect with peripherals, sensors and external devices for flexible interface options.
• Power Supply  Operates from a defined core voltage range of 1.425 V to 1.575 V for predictable power design and margining.
• Package & Mounting  144-LBGA package (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB layouts.
• Industrial Temperature Range  Specified operation from −40°C to 100°C to meet the demands of industrial environments.
• Environmental Compliance  RoHS compliant, supporting environmental and regulatory requirements.
• Industrial Grade  Designated as industrial grade for applications that require extended temperature capability and board-level reliability.

Typical Applications

• Industrial Control  Implement custom control logic, timing and sequencing for factory automation and machine control systems within industrial temperature ranges.
• Embedded Systems  Consolidate glue logic and implement application-specific processing in compact embedded platforms using available logic elements and on-chip RAM.
• Communications & Interfaces  Handle custom interface bridging and I/O management where a moderate number of user I/Os and programmable logic are required.
• Test & Measurement  Create configurable signal processing and measurement front-ends that benefit from reprogrammable logic and deterministic operation.

Unique Advantages

• High-density programmable logic: 13,824 logic elements enable integration of multiple digital functions into a single device, reducing BOM count and board complexity.
• Compact package: 144-LBGA (13×13 FPBGA) surface-mount package minimizes PCB footprint while providing adequate I/O for many embedded designs.
• Industrial-temperature operation: Rated from −40°C to 100°C to maintain functionality in demanding environmental conditions.
• Defined core voltage window: Narrow supply range (1.425 V to 1.575 V) simplifies power budgeting and design verification.
• On-chip memory for control tasks: Approximately 0.11 Mbits of RAM supports buffering and state storage for finite-state machines and small data structures.
• Regulatory compliance: RoHS compliant to meet environmental requirements for commercial and industrial deployments.

Why Choose A3P600-FGG144I?

The A3P600-FGG144I combines a substantial logic resource of 13,824 elements with nearly 0.11 Mbits of on-chip RAM and 97 I/Os in a compact LBGA package, making it an effective choice for industrial embedded designs that require reconfigurable logic and reliable operation across a wide temperature range. Its defined supply window and surface-mount form factor support predictable integration into controlled-power, space-constrained systems.

This device is well suited to engineers and teams seeking a programmable solution to consolidate discrete logic, implement custom interfaces, or prototype application-specific functions while meeting industrial environmental requirements.

Request a quote or submit your requirements today to check availability and pricing for the A3P600-FGG144I.