A3P600-FGG484I

The A3P600-FGG484I is a ProASIC3 field programmable gate array (FPGA) IC designed for industrial applications that require substantial logic capacity, on-chip memory and broad I/O connectivity. Its combination of 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 235 I/O pins supports mid-range digital designs where compact packaging and industrial temperature support are important.

Key Features

• Core Logic 13,824 logic elements providing a total gate equivalent of 600,000 gates for implementing complex digital functions.
• Embedded Memory 110,592 bits of on-chip RAM (approximately 0.11 Mbits) to support data buffering, state storage and small memory structures within designs.
• I/O Density 235 I/O pins to accommodate multiple interfaces, sensor connections and peripheral control without external I/O expanders.
• Package & Mounting 484-BGA package in a 484-FPBGA (23×23) footprint with surface-mount mounting for high-density board layouts.
• Power Operates from a supply range of 1.425 V to 1.575 V, suitable for 1.5 V-class power systems.
• Temperature Range Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS-compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control High logic capacity and industrial temperature range make the device suitable for factory automation, PLCs and motor control logic.
• Embedded Systems On-chip RAM and abundant I/O support embedded processing tasks, peripheral bridging and custom state machines.
• Communications Equipment Large I/O count enables interface aggregation and protocol bridging in mid-range network and communications modules.

Unique Advantages

• Substantial Logic Capacity: 13,824 logic elements and 600,000 gates let you implement complex algorithms and parallel logic structures on a single device.
• Integrated On-Chip Memory: Approximately 0.11 Mbits of embedded RAM reduces reliance on external memory for buffering and small data stores, simplifying BOM and board routing.
• High I/O Count: 235 I/O pins give designers flexibility to connect multiple peripherals, sensors and interfaces directly to the FPGA.
• Industrial-Grade Operation: Specified for −40 °C to 100 °C operation, enabling deployment in temperature-challenging environments.
• Compact, High-Density Packaging: 484-BGA (484-FPBGA, 23×23) package supports high-density PCB designs while maintaining a robust surface-mount form factor.
• RoHS Compliant: Conforms to lead-free requirements for modern manufacturing processes.

Why Choose A3P600-FGG484I?

The A3P600-FGG484I delivers a balanced combination of logic density, embedded memory and extensive I/O in an industrial-grade FPGA package. Its specification set is aimed at engineers who need mid-range programmable logic with reliable thermal performance and compact board-level integration.

This device is well suited to designs that require sizable on-chip logic and memory, substantial peripheral interfacing, and operation across industrial temperature ranges—offering a practical platform for embedded and industrial digital systems.

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