A3P600-PQG208I

The A3P600-PQG208I is an industrial-grade ProASIC3 FPGA optimized for configurable logic integration in embedded systems. It provides a balance of logic capacity, on-chip memory, and a high I/O count in a 208-pin PQFP package suitable for surface-mount assembly.

Key Features

• Logic Capacity — 13,824 logic elements (cells) delivering up to 600,000 gates for implementing custom digital functions and state machines.
• Embedded Memory — Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for buffering, FIFOs, and small data storage requirements.
• I/O Count — 154 user I/O pins to support a wide range of peripheral interfaces and system-level connectivity.
• Power Supply — Core voltage range of 1.425 V to 1.575 V for the device core domain.
• Package & Mounting — 208-BFQFP (supplier package: 208-PQFP, 28 × 28) in a surface-mount form factor compatible with automated PCB assembly.
• Operating Temperature — Industrial temperature rating from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance — RoHS compliant to meet lead-free assembly and environmental requirements.

Typical Applications

• Industrial Control — Implement custom control logic and state machines for factory automation and machine control systems within industrial temperature ranges.
• Embedded I/O Expansion — Aggregate and manage multiple peripheral interfaces using the device’s 154 I/O pins for system-level integration.
• Protocol Bridging — Create custom protocol translators and glue logic leveraging the device’s logic elements and on-chip memory.
• Prototyping and Proof-of-Concept — Use the configurable resources and package compatibility for early hardware validation and integration testing.

Unique Advantages

• Substantial Logic Density: 13,824 logic elements provide the capacity to implement complex finite-state machines and combinational logic without external CPLDs.
• On-Die Memory: Approximately 0.11 Mbits of embedded RAM reduces the need for small external SRAM for buffering and temporary data storage.
• High I/O Count: 154 I/O pins offer flexibility to interface with multiple sensors, actuators, and peripherals directly on-chip.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployments in demanding ambient conditions.
• Surface-Mount PQFP Package: 208-pin (28 × 28) BFQFP package enables compact board-level integration and automated assembly.
• Regulatory Readiness: RoHS compliance simplifies design-in for lead-free manufacturing processes.

Why Choose A3P600-PQG208I?

The A3P600-PQG208I positions itself as a practical FPGA option for industrial embedded designs that require a blend of moderate logic density, embedded memory, and extensive I/O in a surface-mount PQFP footprint. Its industrial temperature rating and RoHS compliance make it suitable for board-level integration where environmental resilience and manufacturing compliance matter.

Engineers designing control systems, protocol bridges, and I/O-centric embedded subsystems will find the device’s resource mix and package options helpful for reducing external component count and simplifying system architecture while maintaining predictable power and thermal domains via the specified core voltage and operating range.

Request a quote or submit an inquiry for the A3P600-PQG208I to check availability and pricing for your project requirements.