A3P600L-1FG484I

The A3P600L-1FG484I is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, delivered in a 484-ball BGA package. This industrial-grade, surface-mount FPGA provides 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, and 235 user I/Os for custom digital logic and I/O-dense designs.

With an operating temperature range of −40 °C to 100 °C and a supply range of 1.14 V to 1.575 V, the device is specified for applications that require a balance of logic capacity, I/O density, and industrial-temperature operation.

Key Features

• Logic Capacity  13,824 logic elements available for implementing custom digital functions and combinational/sequential logic.
• On‑chip Memory  110,592 total RAM bits (approximately 0.11 Mbits) to support buffering, small data storage, and local state retention.
• I/O Density  235 I/Os to support multiple external interfaces, parallel buses, and high-pin-count interconnect requirements.
• Gate Count  Approximately 600,000 gates for medium-complexity system integration and custom acceleration tasks.
• Package and Mounting  484-BGA package (supplier package: 484-FPBGA 23×23) designed for surface-mount assembly in compact board layouts.
• Power  Supported supply range from 1.14 V to 1.575 V to match core voltage requirements of the device.
• Temperature Range  Industrial operating range from −40 °C to 100 °C suitable for demanding thermal environments.
• Compliance  RoHS-compliant manufacturing status.

Typical Applications

• Custom Logic and Prototyping  Implement application-specific datapaths, state machines, and control logic using 13,824 logic elements and 600,000 gates.
• I/O-Intensive Interfaces  Leverage 235 I/Os to connect multiple peripherals, parallel sensors, or wide data buses in a single programmable device.
• On‑chip Buffering and Small Memory Tasks  Use approximately 0.11 Mbits of on-chip RAM for FIFO buffering, small lookup tables, or temporary data storage.

Unique Advantages

• Balanced Logic and Memory  Combines 13,824 logic elements with on‑chip RAM to support both control logic and modest data buffering without external memory.
• High I/O Count  235 user I/Os reduce the need for external I/O expanders and simplify board-level interconnect for complex systems.
• Industrial Temperature Capability  Specified operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
• Compact BGA Packaging  484-ball BGA (23×23) enables high-density PCB integration while maintaining robust electrical connections for high-pin-count designs.
• RoHS Compliance  Manufactured to RoHS standards to meet environmental and regulatory requirements.

Why Choose A3P600L-1FG484I?

The A3P600L-1FG484I is positioned for designs that require a mid-range FPGA with substantial logic resources, significant I/O capacity, and on-chip memory in a compact BGA package. Its industrial temperature rating and surface-mount BGA form factor make it suitable for systems where environmental range and board density matter.

Designed and supplied by Microchip Technology, this FPGA is appropriate for engineers and procurement teams seeking a programmable device that pairs 13,824 logic elements and 235 I/Os with a defined supply and temperature envelope for reliable long-term deployment.

Request a quote or submit a purchase inquiry to receive pricing and availability for the A3P600L-1FG484I.