A3P600L-1FG144I

The A3P600L-1FG144I is a ProASIC3L family FPGA from Microchip Technology providing a mid-density programmable logic fabric. It delivers 13,824 logic elements (approximately 600,000 gates), 110,592 bits of on-chip RAM, and 97 user I/Os in a compact 144-LBGA surface-mount package.

Designed for industrial applications, the device supports a supply voltage range of 1.14 V to 1.575 V and an operating temperature range of -40 °C to 100 °C. RoHS compliance and the 144-FPBGA (13×13) package make it suitable for space- and power-constrained embedded systems that require industrial-grade operating conditions.

Key Features

• Core Logic: 13,824 logic elements providing approximately 600,000 gates for mid-density programmable logic implementations.
• Embedded Memory: Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for data buffering and small memory structures.
• I/O Resources: 97 user I/O pins to support multiple interfaces and external peripherals.
• Power Supply: Operates from a supply voltage range of 1.14 V to 1.575 V to accommodate low-voltage system designs.
• Package & Mounting: 144-LBGA (supplier package: 144-FPBGA 13×13) in a surface-mount form factor for compact board layouts.
• Temperature & Grade: Industrial grade operation with an operating temperature range of -40 °C to 100 °C.
• Regulatory Compliance: RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control: Industrial-grade temperature range and robust I/O count make the device suitable for control logic, custom peripheral interfaces, and automation subsystems.
• Embedded Systems: Mid-density logic capacity and on-chip RAM support glue logic, protocol bridging, and custom peripherals in embedded controllers.
• Data Acquisition and Sensor Interfaces: The combination of logic elements and embedded RAM enables data buffering and preprocessing for sensor and acquisition front ends.

Unique Advantages

• Mid-density Integration: 13,824 logic elements and ~600,000 gates provide sufficient capacity for complex glue logic and moderate FPGA designs without excessive footprint.
• On-chip Memory: Approximately 0.11 Mbits of RAM available for small buffers, FIFOs, and temporary data storage inside the FPGA fabric.
• Generous I/O Count: 97 I/Os allow direct connection to a wide range of peripherals and interfaces, reducing the need for external I/O expanders.
• Industrial Temperature Capability: -40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
• Compact Surface-mount Package: 144-LBGA (144-FPBGA 13×13) balances pin density with board-space efficiency for tightly integrated designs.
• Low-voltage Operation: 1.14 V to 1.575 V supply range enables compatibility with lower-voltage system domains.

Why Choose A3P600L-1FG144I?

The A3P600L-1FG144I combines a mid-density logic fabric, embedded RAM, and a substantial I/O complement in a compact 144-LBGA package, making it a practical choice for engineers building industrial and embedded designs that require programmable logic within a constrained board area. Its industrial temperature rating and RoHS compliance make it suitable for long-term deployment in temperature-challenging environments.

Backed by Microchip Technology, this ProASIC3L FPGA is aimed at designers who need reliable, mid-range programmable logic resources—providing a balanced solution for custom peripherals, interface bridging, and control logic in industrial and embedded applications.

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