A3P600-PQ208I

The A3P600-PQ208I is a ProASIC3 field programmable gate array provided in a 208-BFQFP surface-mount package. It delivers a mid-range logic capacity with 13,824 logic elements and approximately 600,000 gates, combined with 154 user I/O pins and embedded memory resources.

Designed for applications requiring reliable operation across a wide temperature window, this device is specified for industrial operation from -40 °C to 100 °C and operates from a defined supply range of 1.425 V to 1.575 V. The device is RoHS compliant.

Key Features

• Logic Capacity  Approximately 13,824 logic elements providing mid-range programmable logic resources for combinational and sequential functions.
• Gate Count  Approximately 600,000 gates to support complex logic integration within a single FPGA footprint.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for data buffering, state storage, and small lookup tables.
• Rich I/O  154 general-purpose I/O pins to support dense parallel interfacing and multiple external peripherals.
• Power  Specified operating supply range from 1.425 V to 1.575 V for predictable power and logic-level characteristics.
• Package & Mounting  208-BFQFP (supplier package: 208-PQFP 28×28) in a surface-mount format suitable for automated PCB assembly.
• Temperature & Grade  Industrial-grade device rated for operation from -40 °C to 100 °C.
• Environmental Compliance  RoHS compliant to support regulatory requirements for lead-free assemblies.

Unique Advantages

• High logic density for mid-range designs: 13,824 logic elements and ~600k gates enable integration of substantial logic functions without multiple devices.
• Ample I/O for system interfacing: 154 I/O pins provide flexibility for parallel buses, control signals, and multiple external interfaces.
• On-chip memory for local buffering: Approximately 0.11 Mbits of embedded RAM reduces reliance on external memory for small data storage and state machines.
• Industrial temperature capability: Specified -40 °C to 100 °C operation supports deployment in demanding ambient environments.
• Compact surface-mount package: 208-BFQFP (28×28 PQFP style) balances pin count and PCB area for space-conscious designs.
• Regulatory alignment: RoHS compliance helps streamline assembly and regulatory processes for lead-free products.

Why Choose A3P600-PQ208I?

The A3P600-PQ208I positions itself as a robust mid-range FPGA option for designs that need a balance of logic density, I/O capacity, and environmental resilience. With 13,824 logic elements, substantial gate count, and embedded RAM, it supports consolidated implementation of control, interfacing, and custom logic functions within a single package.

This device is suited to teams and projects seeking a surface-mount FPGA with clearly defined supply and thermal specifications—providing predictable electrical behavior and industrial-grade temperature tolerance—backed by RoHS compliance for modern assembly processes.

Request a quote or submit an inquiry to obtain availability and pricing information for the A3P600-PQ208I. Our team will assist with lead times and ordering details.