A3P600-PQ208

The A3P600-PQ208 is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology. This commercial-grade, surface-mount FPGA offers 13,824 logic elements, 154 user I/O, and embedded memory to implement custom digital logic in space-constrained packages.

Designed for applications that require moderate logic capacity, significant I/O count, and low-voltage core operation, the A3P600-PQ208 targets embedded designs where compact packaging and RoHS compliance are important considerations.

Key Features

• Core Logic 13,824 logic elements (logic cells) provide the programmable resources to implement custom digital functions and control logic.
• Embedded Memory 110,592 bits of on-chip RAM (approximately 0.111 Mbits) for data buffering, state storage, and small lookup tables.
• I/O 154 user I/O pins to support a wide range of peripheral interfaces and board-level connectivity.
• Power Core supply voltage specified at 1.425 V to 1.575 V for compatible low-voltage system designs.
• Package Available in a 208-BFQFP package (supplier device package: 208-PQFP, 28×28) suitable for surface-mount assembly.
• Operating Range Commercial-grade operating temperature from 0 °C to 85 °C for standard environmental operating conditions.
• Environmental Compliance RoHS compliant to support environmentally conscious designs and manufacturing.

Typical Applications

• Embedded Systems — Implement custom control logic, glue logic, and peripheral aggregation using the device’s 13,824 logic elements and ample I/O.
• Communication Interfaces — Use the 154 I/O pins for protocol bridging, parallel interface handling, or front-end customization in communication modules.
• Instrumentation and Test — Leverage on-chip RAM and programmable logic for data capture, preprocessing, and timing-critical control tasks.

Unique Advantages

• Compact, high-density logic: 13,824 logic elements give designers substantial programmable resources in a single device.
• Integrated on-chip memory: 110,592 bits of embedded RAM (≈0.111 Mbits) reduce the need for external memory for small buffers and state machines.
• Generous I/O count: 154 user I/O enable broad peripheral connectivity and flexible board-level interfacing.
• Low-voltage core operation: Specified core supply from 1.425 V to 1.575 V to match low-voltage system domains.
• Surface-mount packaging: 208-pin BFQFP/PQFP package supports compact board layouts and automated assembly.
• RoHS compliant: Meets environmental compliance expectations for modern manufacturing.

Why Choose A3P600-PQ208?

The A3P600-PQ208 balances moderate logic capacity, a substantial I/O count, and embedded memory in a compact surface-mount package from Microchip Technology. Its commercial-grade temperature range and RoHS compliance make it suitable for production embedded designs that require reliable programmable logic without specialized environmental ratings.

This device is well suited for engineers designing compact embedded controllers, interface bridges, and instrumentation logic where on-chip resources and package density help reduce BOM complexity and board area. Backed by Microchip Technology manufacturing and documentation, it provides a predictable and verifiable building block for mid-range FPGA-based designs.

Request a quote or submit an RFQ today to check pricing and availability for the A3P600-PQ208.