A3P600-PQG208

The A3P600-PQG208 is a ProASIC3 field programmable gate array from Microchip Technology, delivering a balance of logic capacity, I/O density and embedded memory in a surface-mount PQFP package. With 600,000 gates, 13,824 logic elements and 154 I/Os, it targets designs that require substantial on-chip logic and flexible interfacing while operating from a precise low-voltage supply.

Its specified operating range and package details make it suitable for commercial-grade embedded designs that need a compact, solderable FPGA solution with RoHS compliance.

Key Features

• Core Capacity — 600,000 gates and 13,824 logic elements provide substantial on-chip logic resources for complex combinational and sequential implementations.
• Embedded Memory — approximately 0.11 Mbits of embedded RAM (110,592 bits) for buffering, small data stores and state machines.
• I/O Density — 154 I/O pins to support multiple interfaces, sensor connections and peripheral expansion directly from the FPGA.
• Power — designed for operation from a 1.425 V to 1.575 V supply, enabling integration into low-voltage system rails.
• Package and Mounting — supplied in a 208-BFQFP / 208-PQFP (28×28) package in a surface-mount form factor for board-level integration.
• Commercial Grade — specified for commercial temperature operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant, supporting regulatory requirements for restricted substances.

Typical Applications

• I/O-rich digital systems — integrate multiple peripheral interfaces and sensors using up to 154 I/O lines.
• Embedded logic consolidation — replace discrete components and glue logic with up to 13,824 logic elements and 600,000 gates.
• Low-voltage embedded designs — suitable for systems operating within a 1.425 V to 1.575 V supply range.
• Compact PCB implementations — surface-mount 208-PQFP packaging for space-constrained circuit boards.

Unique Advantages

• High integration density: 600,000 gates and 13,824 logic elements reduce the need for external logic ICs and simplify board design.
• Significant I/O capability: 154 I/Os enable direct connection to a wide range of peripherals and sensors without additional multiplexing hardware.
• Embedded memory for control and buffering: 110,592 bits of on-chip RAM provide local storage for state machines, FIFOs or small data buffers.
• Low-voltage compatibility: Narrow 1.425 V to 1.575 V supply range supports integration into modern low-voltage systems.
• Compact, surface-mount package: 208-PQFP (28×28) packaging offers a small-footprint option for board-level assembly.
• Regulatory alignment: RoHS compliance helps meet environmental and product stewardship requirements.

Why Choose A3P600-PQG208?

The A3P600-PQG208 is positioned for commercial embedded designs that require a robust balance of logic capacity, on-chip memory and high I/O count in a compact surface-mount package. Its combination of 600,000 gates, 13,824 logic elements and 154 I/Os makes it well suited for consolidating discrete logic and implementing moderate-density custom logic blocks.

Backed by Microchip Technology’s ProASIC3 family pedigree and offered in a RoHS-compliant PQFP package with defined commercial temperature and voltage ranges, this device provides a verifiable option for projects that need predictable electrical and thermal characteristics along with substantial on-chip resources.

Request a quote or submit an inquiry to get pricing and availability for the A3P600-PQG208.