A3P600L-1FG484

The A3P600L-1FG484 is a ProASIC3L field programmable gate array (FPGA) device in a 484-ball BGA package, offered as a commercial-grade, surface-mount integrated circuit. It provides a balance of programmable logic capacity, on-chip memory and I/O density in a compact 23 × 23 FPBGA footprint.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 235 general-purpose I/O, this device is suited for commercial applications that require reconfigurable logic, moderate embedded storage and a high pin count in a space-efficient package. The device operates from a 1.14 V to 1.575 V supply and across a 0 °C to 85 °C temperature range.

Key Features

• Core Logic 13,824 logic elements (cells) delivering up to 600,000 gates of programmable logic capacity for implementing custom digital functions.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for local data storage and buffering without external memory.
• I/O Density 235 general-purpose I/O pins to support complex interfacing and multiple external connections from a single device.
• Power Supply Operates from a nominal supply range of 1.14 V to 1.575 V, enabling integration with low-voltage systems.
• Package and Mounting 484-ball FPBGA package (23 × 23) with surface-mount mounting for compact board-level integration.
• Operating Range Commercial-grade operation from 0 °C to 85 °C for standard ambient-temperature applications.
• Compliance RoHS-compliant construction for environmentally conscious designs and regulatory alignment.

Unique Advantages

• High logic capacity in a compact package: 13,824 logic elements and 600,000 gates provide significant programmable resources while maintaining a 484-BGA footprint.
• On-chip memory reduces external parts: Approximately 0.11 Mbits of embedded RAM lowers the need for additional external memory, simplifying bill of materials and board routing.
• Extensive I/O connectivity: 235 I/Os enable versatile interfacing to peripherals, sensors and system buses without adding external I/O expanders.
• Low-voltage operation: 1.14 V to 1.575 V supply range supports integration into modern low-voltage power domains.
• Space-efficient assembly: Surface-mount 484-FPBGA (23 × 23) packaging offers a high-density solution for constrained PCB real estate.
• Regulatory readiness: RoHS compliance aids in meeting environmental requirements for commercial products.

Why Choose A3P600L-1FG484?

The A3P600L-1FG484 positions itself as a versatile commercial-grade FPGA option for engineers who need a balance of programmable logic, embedded memory and broad I/O in a compact BGA package. Its combination of 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM and 235 I/Os supports consolidation of logic functions and interface requirements onto a single device.

This device is well suited for designs that prioritize on-board integration, a high pin count and surface-mount assembly in standard commercial temperature environments. The ProASIC3L form factor and RoHS compliance provide a practical choice for procurement and product development focused on scalability and regulatory alignment.

Request a quote or submit a procurement inquiry to obtain pricing, availability and lead-time information for the A3P600L-1FG484.