A3P600L-1FGG484

The A3P600L-1FGG484 is a ProASIC3L Field Programmable Gate Array (FPGA) from Microchip Technology designed for commercial embedded logic applications. It provides a mid-range programmable fabric with 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 235 user I/O in a 484‑ball BGA package.

Built for surface-mount assembly and commercial operating environments, the device supports a core voltage range of 1.14 V to 1.575 V and operates across 0 °C to 85 °C, delivering a compact, programmable solution for a variety of custom digital designs.

Key Features

• Logic Capacity — 13,824 logic elements (logic cells) offering substantial programmable logic resources for mid-range designs.
• On‑Chip Memory — Approximately 0.11 Mbits of embedded RAM (110,592 bits) to support buffering, state storage, and local data handling.
• Gate Equivalent — 600,000 gates of logic density to implement complex combinational and sequential functions.
• I/O Resources — 235 user I/O pins to interface with peripherals, sensors, and external devices.
• Power — Core supply range from 1.14 V to 1.575 V, enabling integration with common system power rails.
• Package and Mounting — 484‑ball FPBGA (23 × 23) package in a surface-mount form factor for high‑density PCB designs.
• Operating Range — Commercial grade device specified for 0 °C to 85 °C ambient operation.
• Compliance — RoHS compliant.

Typical Applications

• Custom digital logic implementations — Use the 13,824 logic elements to implement tailored state machines, protocol handlers, and application-specific datapaths.
• Interface bridging and I/O expansion — Leverage 235 I/O pins to bridge multiple peripherals, convert interfaces, or expand system connectivity.
• Embedded control and sequencing — On‑chip RAM and rich logic resources support control loops, sequencing, and local buffering in commercial embedded systems.

Unique Advantages

• Substantial on‑chip resources: 13,824 logic elements and 600,000 gate-equivalent density provide the capacity to consolidate multiple discrete functions into a single device.
• Integrated memory: Approximately 0.11 Mbits of embedded RAM reduces dependence on external memory for intermediate buffering and state retention.
• High I/O count: 235 user I/Os enable flexible board-level integration and support for multiple interfaces without additional I/O expanders.
• Compact BGA package: 484‑ball FPBGA (23 × 23) keeps board footprint minimized while supporting high pin density for complex designs.
• Commercial temperature and RoHS compliance: Specified for 0 °C to 85 °C operation and RoHS status supporting standard commercial assemblies.

Why Choose A3P600L-1FGG484?

The A3P600L-1FGG484 positions itself as a versatile, mid-range FPGA for commercial embedded designs that require a balanced combination of logic capacity, on‑chip memory, and a high I/O count. Its 484‑ball BGA package and surface-mount mounting suit compact, high-density PCBs where board space and pin count matter.

Backed by Microchip Technology, this ProASIC3L device is appropriate for engineers seeking a programmable solution to consolidate discrete logic, implement custom interfaces, or add application-specific acceleration while operating within commercial temperature ranges.

Request a quote or submit an inquiry to purchase the A3P600L-1FGG484 for your next programmable logic design.