A3P600L-FG484

The A3P600L-FG484 is a ProASIC3L field programmable gate array (FPGA) IC from Microchip Technology, designed for commercial embedded applications requiring significant logic capacity and I/O density. It combines 13,824 logic elements with a gate count of 600,000 to enable complex custom digital designs.

With 235 user I/O pins, approximately 0.11 Mbits of on-chip RAM, a 484-ball FPBGA package (23×23) and surface-mount mounting, this device is targeted at commercial OEM designs and embedded systems where board-level integration and compact packaging are important.

Key Features

• Core Logic  13,824 logic elements (LEs) provide the programmable fabric for implementing custom digital circuits and state machines.
• Logic Capacity  Approximately 600,000 gates of logic capacity to support medium-to-large combinational and sequential designs.
• Embedded Memory  Total on-chip RAM of 108,000 bits (approximately 0.11 Mbits) for local storage, buffering and small data structures.
• I/O Density  235 user I/O pins to support multiple interfaces, peripherals and board-level connectivity.
• Power  Single supply operation at 1.14 V as specified for the device.
• Package & Mounting  484-FPBGA (23×23) package in a surface-mount form factor; package shipped in tray format for production handling.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation, suitable for commercial-grade applications.

Typical Applications

• Commercial embedded systems  Implement custom control logic, glue logic and protocol handling in compact OEM products.
• Communications equipment  Support multi-channel I/O and moderate on-chip memory for packet buffering and interface bridging.
• Consumer and industrial user interfaces  Drive display controllers, sensor aggregation and custom peripheral control within a commercial temperature range.

Unique Advantages

• High logic density: The combination of 13,824 logic elements and 600,000 gates lets designers implement substantial logic functions on a single device, reducing external components.
• Ample I/O count: 235 user I/O pins provide flexibility to connect multiple peripherals and interfaces without external multiplexing.
• On-chip memory: Approximately 0.11 Mbits of embedded RAM supports local buffering and small data structures, improving data throughput and latency for on-chip functions.
• Compact BGA packaging: The 484-FPBGA (23×23) surface-mount package enables dense PCB layouts and reliable solder connections for production assemblies.
• Commercial-ready temperature range: Rated 0 °C to 85 °C to match the requirements of general-purpose commercial electronic products.
• Single-voltage operation: Specified at 1.14 V, simplifying power rail requirements for designs targeting this device.

Why Choose A3P600L-FG484?

The A3P600L-FG484 delivers a balanced combination of logic capacity, I/O density and on-chip memory in a compact 484-ball FPBGA package, making it well suited for commercial OEM and embedded applications that require substantial programmable logic without excessive board area. Its commercial temperature rating and surface-mount packaging align with production-focused designs.

Backed by Microchip Technology as the manufacturer, this ProASIC3L device is an option for teams seeking a scalable programmable fabric to consolidate discrete logic, manage multiple interfaces, and streamline BOM count within commercial-grade products.

Request a quote or submit a purchase inquiry to receive pricing and availability for the A3P600L-FG484. Our team can provide ordering details and support for procurement and deployment.