A3P600L-FGG144

The A3P600L-FGG144 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, providing mid-range programmable logic density in a compact 144-LBGA package. It combines 13,824 logic elements (equivalent to 600,000 gates) with on-chip embedded memory and 97 programmable I/Os to address commercial applications that require flexible digital logic, custom interfaces, and on-board memory.

Designed for surface-mount assembly and operation across a commercial temperature range, the device supports a supply voltage range of 1.14 V to 1.575 V and is RoHS compliant.

Key Features

• Core Logic 13,824 logic elements (approximately 600,000 gates) for implementing mid-range digital logic and custom processing blocks.
• Embedded Memory Total on-chip RAM of 110,592 bits—approximately 0.11 Mbits—suitable for buffering, small data stores, and state machines.
• I/O Density 97 programmable I/Os to support multiple external interfaces, custom peripherals, and glue-logic functions.
• Power Support for a core supply range from 1.14 V to 1.575 V, enabling designs tailored to specified power domains.
• Package & Mounting 144-LBGA (supplier package 144-FPBGA, 13×13) in a surface-mount form factor for compact board integration.
• Operating Range Commercial grade operation from 0 °C to 85 °C for mainstream embedded and commercial deployments.
• Compliance RoHS compliant for environmentally regulated assemblies.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol bridging, and peripheral interfaces where mid-range logic and on-chip memory are required.
• Communication Equipment — Provide flexible I/O and programmable datapath resources for interface adaptation and protocol-specific logic.
• Consumer and Industrial Control — Enable user interface control, device sequencing, and custom timing/logic functions within commercial temperature limits.

Unique Advantages

• Right-sized Logic Density: 13,824 logic elements and 600,000 gates provide substantial capacity for mid-range designs without incurring large-package overhead.
• On-chip Memory: Approximately 0.11 Mbits of embedded RAM reduces the need for external memory for small buffers and state storage.
• Flexible I/O Count: 97 I/Os support multiple interfaces and custom peripheral connections, simplifying board-level design.
• Compact Surface-Mount Package: 144-LBGA (13×13 FPBGA) enables dense PCB layouts for space-constrained applications.
• Commercial Temperature Support: Rated 0 °C to 85 °C for reliable operation in mainstream commercial environments.
• Regulatory-Friendly: RoHS compliance supports environmentally responsible product builds.

Why Choose A3P600L-FGG144?

The A3P600L-FGG144 positions itself as a mid-range, commercially graded FPGA that balances logic capacity, embedded memory, and I/O flexibility in a compact LBGA package. Its combination of 13,824 logic elements, roughly 0.11 Mbits of on-chip RAM, and 97 I/Os makes it suitable for design teams implementing custom digital logic, interface adaptation, or control functions where board space and integration matter.

Manufactured by Microchip Technology and packaged for surface-mount assembly, the device offers a practical option for commercial embedded products that require programmable logic, predictable operating limits, and RoHS compliance.

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