A3P600L-FGG484

The A3P600L-FGG484 is a ProASIC3L field programmable gate array (FPGA) from Microchip Technology, supplied in a 484-ball FPBGA package. It delivers a balance of programmable logic capacity, on-chip memory, and I/O density for commercial embedded designs that require customizable digital functions.

With 13,824 logic elements, approximately 110,592 bits of embedded RAM, and 235 user I/O signals, this device targets applications that need moderate logic resources, flexible interfacing, and a compact surface-mount package.

Key Features

• Core Logic  600,000 gates and 13,824 logic elements provide a programmable fabric for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 110,592 bits of on-chip RAM for buffers, FIFOs, and small data tables inside the FPGA fabric.
• I/O Density  235 user I/O pins accommodate multiple interfaces and peripheral connections directly from the package.
• Power  Operating supply range of 1.14 V to 1.575 V to meet low-voltage system requirements.
• Package & Mounting  484-FPBGA (23×23) package, surface-mount mounting type, ideal for compact PCB layouts requiring a high-pin-count device.
• Operating Range & Grade  Commercial grade device rated for operation from 0 °C to 85 °C and RoHS compliant for environmental compliance.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, data handling, or glue logic in embedded products where commercial temperature operation is acceptable.
• Interface and Protocol Bridging  Use the device's 235 I/O signals to implement protocol conversion, signal aggregation, or custom peripheral interfaces.
• Digital Prototyping  Deploy the FPGA fabric and on-chip RAM for proof-of-concept designs and iterative hardware development.

Unique Advantages

• Balanced Logic Capacity:  13,824 logic elements and 600,000 gates provide a mid-range programmable resource set for a wide set of commercial designs.
• Integrated On-Chip Memory:  Approximately 0.11 Mbits of embedded RAM reduces the need for external memory in many buffering and data-path scenarios.
• High I/O Count:  235 I/O pins enable multiple parallel interfaces and flexible board-level connectivity without complex external multiplexing.
• Compact BGA Package:  The 484-FPBGA (23×23) package delivers high pin count in a compact footprint for space-constrained PCBs.
• Low-Voltage Operation:  A supply range from 1.14 V to 1.575 V supports integration into low-voltage system designs.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C, suitable for standard commercial-environment applications.

Why Choose A3P600L-FGG484?

The A3P600L-FGG484 positions itself as a commercial-grade, mid-capacity FPGA that combines programmable logic, embedded RAM, and substantial I/O in a compact BGA package. Its specification set is well suited to engineers who need flexible digital implementation with moderate resource needs and a high pin count for interfacing.

This device is appropriate for teams building commercial embedded products, interface modules, or prototypes where a balance of integration, package density, and on-chip memory reduces board-level complexity and component count while maintaining design flexibility.

Request a quote or submit an inquiry to get pricing and availability information for the A3P600L-FGG484.