A3PE1500-1FG484I

The A3PE1500-1FG484I is a ProASIC3E Field Programmable Gate Array (FPGA) IC provided in a 484-ball BGA package. It delivers a balanced combination of logic density, on-chip memory and I/O capacity intended for industrial embedded applications.

With 38,400 logic elements, approximately 0.276 Mbits of embedded memory and 280 I/Os, this device is aimed at designs that require significant programmable logic capacity, a large number of external connections and operation across industrial temperature ranges.

Key Features

• Core Logic  38,400 logic elements and approximately 1,500,000 gates provide substantial programmable logic resources for medium-complexity designs.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM (276,480 total RAM bits) to support FIFOs, buffers and small data storage needs without external memory.
• I/O Capacity  280 user I/Os to support multi-channel interfaces, parallel buses and mixed-signal front-ends requiring many external connections.
• Power  Core supply operating range of 1.425 V to 1.575 V for integration into low-voltage power domains.
• Package & Mounting  Surface-mount 484-ball FPBGA package (484-FPBGA, 23×23) for compact board-level integration in space-constrained designs.
• Operating Range  Rated for industrial operation from −40 °C to 100 °C, suitable for harsh-environment deployments.
• Compliance  RoHS compliant to meet contemporary environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Custom logic for PLCs, motion controllers and automation systems that benefit from 38,400 logic elements and a broad I/O count.
• Embedded Communications  Protocol bridging, packet processing and interface aggregation using on-chip logic and memory with up to 280 I/Os.
• Test & Measurement  Custom timing, data acquisition and pre-processing functions where deterministic logic and industrial temperature operation are required.

Unique Advantages

• High logic density: 38,400 logic elements and 1.5M gates enable implementation of substantial custom logic without external ASICs.
• Ample I/O connectivity: 280 I/Os reduce the need for expansion devices when interfacing multiple external peripherals and sensors.
• On-chip memory: Approximately 0.276 Mbits of embedded RAM supports buffering and small data structures without external memory chips.
• Industrial temperature rating: Specified −40 °C to 100 °C for reliable operation in mechanically and thermally demanding environments.
• Compact BGA package: 484-FPBGA (23×23) surface-mount package enables high-density board layouts while maintaining robust solder connections.
• RoHS compliant: Meets RoHS environmental requirements for modern manufacturing processes.

Why Choose A3PE1500-1FG484I?

The A3PE1500-1FG484I positions itself as a versatile FPGA option for engineers who need a mix of significant programmable logic, on-chip memory and a large I/O complement within a compact BGA footprint. Its industrial-grade temperature rating and RoHS compliance make it suitable for embedded systems deployed in challenging environments.

This device is appropriate for teams designing mid-to-high complexity programmable logic solutions that require long-term reliability, board-level integration density and direct access to a substantial number of external signals.

Request a quote or submit an inquiry to get pricing and availability for the A3PE1500-1FG484I and to discuss how it can fit into your next design.