A3PE1500-1FGG484

The A3PE1500-1FGG484 is a ProASIC3E Field Programmable Gate Array (FPGA) IC supplied in a 484-ball BGA package. It delivers a combination of logic capacity, on-chip memory, and a high I/O count for commercial electronic designs.

With 38,400 logic elements, approximately 0.276 Mbits of embedded memory and 280 I/Os, this FPGA is positioned for commercial applications that require configurable logic, significant I/O density and a compact surface-mount footprint.

Key Features

• Core Logic  38,400 logic elements providing a total of 1,500,000 gates for implementing custom digital functions and glue logic.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM (276,480 bits) to support buffering, small FIFOs and local data storage.
• I/O Density  280 general-purpose I/Os to support multiple peripherals, interfaces and board-level interconnections.
• Power  Core supply voltage specified at 1.425 V to 1.575 V for predictable power provisioning and system integration.
• Package & Mounting  484-ball FPBGA package (484-FPBGA, 23×23) in a surface-mount form factor for compact PCB layouts and reliable solder attachment.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant for environmental conformity.

Typical Applications

• Consumer Electronics  Implement custom peripheral interfaces, display controllers and application-specific logic where compact packaging and moderate logic capacity are required.
• Communications Equipment  Provide protocol glue logic, data path control and I/O aggregation using the FPGA’s high I/O count and logic resources.
• Embedded Control Systems  Enable configurable control logic and signal processing tasks in commercial embedded products that need on-chip memory and flexible I/O.
• Prototyping & Development  Use as a platform for validating digital designs and integrating custom logic blocks prior to production deployment.

Unique Advantages

• High logic capacity: 38,400 logic elements and 1,500,000 gates allow implementation of substantial combinational and sequential logic.
• On-chip memory available: Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for small buffers and state storage.
• Substantial I/O resources: 280 I/Os simplify integration with multiple peripherals and board-level signals, reducing the need for external glue chips.
• Compact surface-mount package: 484-FPBGA (23×23) enables high-density PCB designs while maintaining manufacturability.
• Commercial temperature-grade: Rated 0 °C to 85 °C to match typical commercial product environments and lifecycle requirements.
• RoHS compliant: Meets RoHS environmental requirements for modern electronics manufacturing.

Why Choose A3PE1500-1FGG484?

The A3PE1500-1FGG484 balances logic density, embedded memory and a high I/O count in a compact 484-BGA surface-mount package, making it well suited for commercial designs that need configurable digital logic and flexible interfacing. Its specified core voltage range and commercial operating temperature rating provide clear integration parameters for system power and thermal design.

This device is a practical option for engineers and procurement teams building communications, consumer or embedded products that require mid-to-high logic capacity, on-chip RAM for local data handling, and a dense I/O complement—delivered in a RoHS-compliant package.

Request a quote or submit an inquiry to obtain pricing, availability and further procurement details for the A3PE1500-1FGG484.