A3PE1500-1FGG676I

The A3PE1500-1FGG676I is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology. It provides a programmable logic fabric with 38,400 logic elements, approximately 0.276 Mbits of embedded RAM, and 444 I/O for designs that require extensive on-chip logic and connectivity.

Designed and specified for industrial use, this device combines substantial logic capacity, on-chip memory, and a high I/O count in a 676-FBGA (27×27) surface-mount package, with an operating voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core / Logic – 38,400 logic elements and 1,500,000 gates provide the programmable resources for implementing complex custom logic and control functions.
• Embedded Memory – Total on-chip RAM of 276,480 bits (approximately 0.276 Mbits) for buffering, state storage, and small data structures.
• I/O Capacity – 444 I/O pins enable dense external interfacing and signal routing for multi-channel designs.
• Power – Specified supply voltage range from 1.425 V to 1.575 V for core operation.
• Package & Mounting – 676-BGA package (supplier package: 676-FBGA, 27×27) with surface-mount construction to minimize board footprint.
• Temperature & Grade – Industrial-grade device with an operating temperature range of −40 °C to 100 °C for temperature-tolerant applications.
• Environmental Compliance – RoHS compliant.

Typical Applications

• Industrial Systems – Programmable logic for industrial equipment where an industrial temperature range and robust logic capacity are required.
• High‑I/O Interface Aggregation – Consolidating multiple signals or protocols using the device’s 444 I/O pins to reduce board-level complexity.
• Embedded Control and Glue Logic – Implementing custom control, interfacing, and protocol bridging using the on-chip logic and memory.

Unique Advantages

• High logic density: 38,400 logic elements and 1,500,000 gates enable implementation of sizable custom logic designs on a single device.
• On-chip RAM: Approximately 0.276 Mbits of embedded memory provides local buffering and state retention without external RAM.
• Extensive I/O: 444 I/O pins support dense external connectivity for multi-channel and multi-interface designs.
• Industrial readiness: Industrial-grade specification with −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact packaging: 676-FBGA (27×27) surface-mount package offers a space-efficient solution for board-level integration.
• Regulatory compliance: RoHS compliance addresses environmental and regulatory requirements.

Why Choose A3PE1500-1FGG676I?

The A3PE1500-1FGG676I positions itself as a robust, industrial-grade FPGA option from Microchip Technology, combining a large logic element count, meaningful on-chip RAM, and a very high I/O count in a compact 676-FBGA package. Its specified supply voltage and broad operating temperature range make it suitable for designs that require predictable electrical and thermal behavior.

This device is well suited for engineers and procurement teams building industrial systems, high-density interface solutions, or embedded logic functions where board space, I/O capacity, and industrial temperature performance are key considerations. Its manufacturer pedigree and measurable specifications support long-term design planning and integration.

Request a quote or submit a quotation request to obtain pricing and availability for the A3PE1500-1FGG676I.