A3PE1500-1PQG208

The A3PE1500-1PQG208 is a ProASIC3E field programmable gate array (FPGA) IC from Microchip Technology in a 208-BFQFP (208-PQFP, 28×28) surface-mount package. It provides a mid-density FPGA resource set with 38,400 logic elements and approximately 0.276 Mbits of embedded RAM for commercial embedded logic designs.

With 147 user I/O pins, a gate count of 1,500,000, and an operating voltage window of 1.425 V to 1.575 V, this device is specified for commercial-temperature operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

• Logic Capacity — 38,400 logic elements (equivalent logic cells) supporting complex programmable logic implementations and moderate-density designs.
• On-chip Memory — Approximately 0.276 Mbits of embedded RAM for data buffering, state storage, and local memory needs within the FPGA fabric.
• I/O Resources — 147 user I/O pins enabling connection to multiple peripherals, buses, and external devices.
• Gate Count — 1,500,000 gates providing a metric of the device’s overall logic capacity.
• Power Supply — Operates from 1.425 V to 1.575 V, suitable for systems designed around this core supply requirement.
• Package & Mounting — 208-BFQFP (208-PQFP, 28×28) surface-mount package for PCB assembly in space-conscious layouts.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for commercial applications.
• Regulatory — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Use the device’s 38,400 logic elements and 147 I/O to implement custom control logic and protocol bridging in commercial products.
• Control and Interface Logic — Implement state machines, glue logic, and I/O expansion where mid-density programmable logic is required.
• Prototyping and Evaluation — A suitable platform for development and validation of logic architectures that fit within the device’s gate and RAM resources.

Unique Advantages

• Balanced Logic and Memory — 38,400 logic elements combined with approximately 0.276 Mbits of embedded RAM supports designs that need both combinational logic and local storage.
• Substantial I/O Count — 147 I/O pins provide flexibility for interfacing to multiple peripherals without external I/O expanders.
• Compact Surface-Mount Package — 208-BFQFP (28×28) package facilitates integration into compact PCBs while maintaining accessibility to a high pin count.
• Narrow Core Voltage Window — Defined supply range (1.425 V–1.575 V) simplifies power-rail planning for systems targeting this core voltage.
• Commercial Temperature Rating — Rated 0 °C to 85 °C for standard commercial deployments.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing processes.

Why Choose A3PE1500-1PQG208?

The A3PE1500-1PQG208 positions itself as a mid-density, commercial-grade FPGA solution that combines a substantial logic element count, embedded RAM, and a high I/O count in a compact 208-BFQFP surface-mount package. Its defined supply range and temperature rating make it suitable for commercial embedded designs that require predictable electrical and thermal operating windows.

This device is appropriate for designers seeking a programmable logic device with a clear balance between logic resources, on-chip memory, and I/O capability, backed by a known manufacturer, Microchip Technology. It offers a practical option for system designs where these specific, verifiable hardware characteristics align with project requirements.

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