A3PE1500-2FG676

The A3PE1500-2FG676 is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology designed for commercial embedded applications. This device combines a high I/O count and substantial programmable logic resources to support complex digital designs that require dense I/O integration and on-chip memory.

Built with 38,400 logic elements and approximately 0.28 Mbits of embedded RAM, the A3PE1500-2FG676 targets system designs that demand broad connectivity, moderate logic density, and a compact 676‑BGA footprint.

Key Features

• Core Logic  38,400 logic elements (LEs) providing a flexible fabric for implementing custom digital functions and state machines.
• On‑Chip Memory  276,480 total RAM bits — approximately 0.28 Mbits of embedded memory for buffering, FIFOs, and small data structures.
• Logic Capacity  Approximate gate equivalent of 1,500,000 gates to support sizable combinational and sequential logic implementations.
• I/O Density  444 general-purpose I/O pins to accommodate high‑pin‑count interfaces and multi‑channel connectivity in a single device.
• Power  Specified core/IO supply range of 1.425 V to 1.575 V for predictable power budgeting and system integration.
• Package & Mounting  676‑FBGA (27×27) package in a surface‑mount format (676‑BGA package case) for compact board placement and high pin density.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C suitable for a wide range of non‑industrial applications.
• Compliance  RoHS‑compliant construction to meet common environmental and procurement requirements.

Typical Applications

• Commercial Embedded Systems  Implement control logic, custom state machines, and peripheral interfaces in consumer and commercial products.
• High‑Density I/O Bridging  Aggregate and translate multiple high‑pin interfaces using the device's 444 I/O pins for system-level connectivity.
• Custom Interface & Peripheral Expansion  Add protocol handling, glue logic, or bespoke I/O functions to extend microcontroller or processor capabilities.
• Prototyping and System Integration  Validate multi‑I/O subsystems and custom logic before committing to production silicon or larger FPGA families.

Unique Advantages

• High I/O Count: 444 I/O pins enable consolidation of multiple interfaces on a single device, reducing external level translators and connectors.
• Substantial Logic Resources: 38,400 logic elements provide the capacity to implement complex control and data‑path functions without external ASICs.
• On‑Chip RAM: Approximately 0.28 Mbits of embedded memory supports buffering and small data structures, reducing external memory needs.
• Compact, High‑Density Package: The 676‑FBGA (27×27) package delivers high pin count in a small footprint for space-constrained board designs.
• Commercial‑Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance to align with standard commercial product lifecycles and procurement.

Why Choose A3PE1500-2FG676?

The A3PE1500-2FG676 balances high I/O density and substantial programmable logic in a compact BGA package, making it well suited for commercial embedded designs that require broad connectivity and integrated memory. Its defined supply range and commercial temperature rating simplify system power and thermal planning for mainstream applications.

Designed by Microchip Technology, this ProASIC3E FPGA offers a combination of logic capacity, on‑chip RAM, and a large I/O count that supports scalable designs, faster integration, and reduced bill-of-materials for projects focused on commercial markets.

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