A3PE1500-2FGG484

The A3PE1500-2FGG484 is a ProASIC3E Field Programmable Gate Array (FPGA) from Microchip Technology offered in a 484-ball fine-pitch BGA package. It provides substantial logic capacity and I/O density in a compact surface-mount package.

With 38,400 logic elements, approximately 1,500,000 gates and approximately 0.276 Mbits of embedded memory, this device targets designs that require high gate and I/O counts while operating within standard commercial temperature and supply ranges.

Key Features

• Core Capacity — 38,400 logic elements (LABs/CLBs) and approximately 1,500,000 gates provide significant programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 0.276 Mbits of total on-chip RAM to support buffering, FIFOs and small data stores within the FPGA fabric.
• I/O Resources — 280 user I/Os to support multiple external interfaces and dense signal connectivity.
• Package — 484-FPBGA (23×23) package case designed for surface-mount assembly and compact board layouts.
• Power — Core voltage supply range from 1.425 V to 1.575 V for defined supply requirements.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Complex digital logic integration — Use the device’s 38,400 logic elements and 1,500,000 gates to consolidate custom logic, state machines and data-path functions onto a single FPGA.
• High-density I/O hubs — Leverage 280 I/Os for signal aggregation, protocol bridging or multi-channel interfaces where many external connections are required.
• Compact board designs — The 484-FPBGA (23×23) surface-mount package supports space-constrained PCB layouts that need high logic and I/O density.

Unique Advantages

• High logic and gate count: 38,400 logic elements and approximately 1,500,000 gates enable implementation of sizeable digital functions without partitioning across multiple devices.
• Embedded on-chip memory: Approximately 0.276 Mbits of RAM reduces reliance on external memory for small buffers and temporary storage.
• Extensive I/O availability: 280 user I/Os provide flexibility to connect multiple peripherals, interfaces and high-pin-count subsystems.
• Compact BGA footprint: 484-FPBGA (23×23) package supports high-density board layouts while remaining a surface-mount solution.
• Defined supply and thermal envelope: Clear voltage supply range (1.425 V–1.575 V) and commercial operating temperature (0 °C–85 °C) simplify power and thermal planning.
• RoHS compliant: Meets common environmental compliance requirements for modern electronic assemblies.

Why Choose A3PE1500-2FGG484?

The A3PE1500-2FGG484 combines a large programmable fabric with substantial I/O and on-chip memory in a compact 484-FPBGA package, making it well suited for designs that require consolidated digital logic and dense external connectivity within a commercial-temperature platform. Its clearly specified supply and temperature ranges make system planning straightforward.

This device is appropriate for engineers and procurement teams seeking a Microchip Technology ProASIC3E FPGA option that delivers notable logic capacity, I/O resources and embedded memory in a surface-mount BGA package while maintaining RoHS compliance.

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