A3PE1500-2FGG676I

The A3PE1500-2FGG676I is a ProASIC3E field programmable gate array (FPGA) from Microchip Technology. It provides a high-density programmable logic fabric with 38,400 logic elements, extensive I/O, and embedded memory suitable for complex, I/O‑centric designs. With industrial-grade temperature range and surface-mount 676‑BGA packaging, it is intended for reliable deployment in demanding electronic systems.

Key Features

• Logic Capacity — 38,400 logic elements (equivalent logic cells) and approximately 1,500,000 gates to implement complex combinational and sequential logic functions.
• Embedded Memory — Approximately 0.276 Mbits of on‑chip RAM (276,480 total RAM bits) for buffering, FIFOs, and local data storage within the FPGA fabric.
• High I/O Count — 444 user I/O pins to support wide parallel interfaces, multiple peripherals, and dense connector applications.
• Package and Mounting — Supplied in a 676‑FBGA (27 × 27 mm) package, designed for surface mount assembly to support compact PCB layouts.
• Power Supply Range — Operates from 1.425 V to 1.575 V supply, enabling defined core power requirements for system power budgeting.
• Industrial Temperature — Rated for operation from −40 °C to 100 °C to meet elevated environmental requirements.
• Regulatory Compliance — RoHS compliant, supporting environmental and manufacturing lead‑free requirements.

Typical Applications

• Industrial Control — Use the industrial temperature rating and high I/O count for control systems, PLC expansions, and factory automation interfaces.
• Interface Bridging — Implement protocol conversion and wide parallel-to-serial bridging leveraging 444 I/O pins and abundant logic elements.
• Embedded Logic Acceleration — Offload timing-sensitive or parallelizable tasks to the FPGA fabric using the available logic capacity and on‑chip RAM.

Unique Advantages

• High Logic Density: 38,400 logic elements and 1,500,000 gates provide substantial capacity for complex logic integration on a single device, reducing external components.
• Generous Embedded Memory: Approximately 0.276 Mbits of on‑chip RAM supports local data buffering and state storage without immediate external memory dependence.
• Extensive I/O: 444 I/O pins enable connectivity to numerous peripherals, sensors, and buses, simplifying board-level routing for I/O‑heavy applications.
• Industrial Reliability: Rated operation from −40 °C to 100 °C and RoHS compliance support deployment in industrial environments with environmental constraints.
• Compact BGA Package: 676‑FBGA (27 × 27 mm) packaging balances high pin count with a compact footprint for space-constrained designs.
• Manufacturer Backing: Produced by Microchip Technology, providing continuity in supply and documentation from a recognized semiconductor supplier.

Why Choose A3PE1500-2FGG676I?

The A3PE1500-2FGG676I combines substantial logic resources, embedded memory, and a high I/O count in a single industrial-grade FPGA package, making it well suited for designs that require dense programmable logic and extensive external interfacing. Its defined core voltage range and surface-mount 676‑BGA package support integration into modern PCB assemblies where board space and power budgeting are considerations.

Engineers and procurement teams seeking a robust FPGA solution for industrial and I/O-intensive applications will find the A3PE1500-2FGG676I offers a balance of capacity, connectivity, and environmental range, backed by Microchip Technology.

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