A3PE1500-2PQG208

The A3PE1500-2PQG208 is a ProASIC3E family Field Programmable Gate Array (FPGA) from Microchip Technology, offered in a 208-BFQFP surface-mount package. It delivers a mid-density programmable logic resource set with a defined set of I/O, on-chip memory and power/temperature parameters suited to commercial electronic designs.

With 38,400 logic elements and approximately 0.276 Mbits of embedded memory, this device targets applications that require integrated logic, moderate embedded memory, and a substantial I/O count while operating within standard commercial voltage and temperature ranges.

Key Features

• Logic Capacity  38,400 logic elements and approximately 1,500,000 gates provide a mid-density programmable fabric for glue logic, finite-state machines and custom peripheral integration.
• Embedded Memory  Total on-chip RAM of 276,480 bits, equivalent to approximately 0.276 Mbits of embedded memory for buffering, small FIFOs and lookup tables.
• I/O Count  147 user I/O pins to support multiple interfaces and peripheral connections without external multiplexing.
• Package and Mounting  208-BFQFP (supplier designation 208-PQFP, 28 × 28) surface-mount package for compact board-level integration.
• Power  Specified core voltage supply range of 1.425 V to 1.575 V to match standard ProASIC3E power rails.
• Operating Conditions  Commercial-grade temperature range from 0 °C to 85 °C for typical commercial environments.
• Environmental Compliance  RoHS-compliant construction supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Commercial Embedded Systems  Integrate custom control logic and peripheral interfaces where mid-range logic density and substantial I/O are required.
• Consumer Electronics  Implement glue logic, custom timing, and I/O aggregation in compact packages for consumer devices operating in commercial temperature ranges.
• Communications and Networking  Use the available logic and on-chip RAM for packet buffering, protocol handling and interface bridging in communications equipment.
• Prototyping and Development  Leverage the device’s logic capacity and I/O count for design validation and proof-of-concept implementations.

Unique Advantages

• Balanced Logic and Memory:  38,400 logic elements combined with approximately 0.276 Mbits of embedded RAM support a wide range of mid-density logic functions without excessive external memory.
• High I/O Count:  147 I/O pins reduce the need for external I/O expanders and simplify integration with multiple peripherals and interfaces.
• Compact, Board-Friendly Package:  208-BFQFP surface-mount package (28 × 28 PQFP footprint) enables dense PCB layouts while maintaining accessible pinout.
• Defined Power Envelope:  A clear core supply range of 1.425 V to 1.575 V simplifies power-supply selection and validation for commercial designs.
• Commercial Temperature and RoHS Compliance:  Rated 0 °C to 85 °C and RoHS-compliant for deployments in standard commercial environments with lead-free assembly requirements.

Why Choose A3PE1500-2PQG208?

The A3PE1500-2PQG208 positions itself as a practical choice for engineers requiring a mid-density ProASIC3E FPGA with substantial I/O, moderate embedded memory and a clear commercial operating envelope. Its combination of 38,400 logic elements, approximately 0.276 Mbits of on-chip RAM and 147 I/O makes it well suited to designs that need integrated logic and interface consolidation in a compact package.

Delivered by Microchip Technology as part of the ProASIC3E family, this device provides a deterministic specification set—package, voltage range and temperature rating—that supports predictable integration and lifecycle planning for commercial product lines.

Request a quote or submit a parts inquiry to check availability, pricing and lead times for the A3PE1500-2PQG208. Technical sales and product specialists can provide ordering details and supply information.