A3PE1500-2FGG676

The A3PE1500-2FGG676 is a ProASIC3E flash-based field programmable gate array (FPGA) from Microchip Technology. It provides a mid-range integration point with 38,400 logic elements and approximately 1,500,000 gates to implement complex digital functions.

With 444 user I/Os, approximately 0.276 Mbits of embedded memory, a 676-FBGA (27×27) package, and a commercial operating range, this device is suited for commercial electronics and embedded systems that require significant logic capacity and high I/O density within a surface-mount BGA package.

Key Features

• Logic Capacity — 38,400 logic elements (cells) providing approximately 1,500,000 gates for implementing medium-complexity digital designs.
• Embedded Memory — Approximately 0.276 Mbits of on-chip RAM to support data buffering, state machines, and small memory-intensive functions.
• High I/O Count — 444 user I/Os to accommodate wide parallel buses, multiple peripherals, and dense external connectivity.
• Package and Mounting — 676-FBGA (27×27) package in a surface-mount form factor for compact PCB integration and high pin count routing.
• Power — Nominal supply range of 1.425 V to 1.575 V to meet device core voltage requirements.
• Operating Range and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for typical commercial environments.
• Regulatory — RoHS compliant to support restricted-substance requirements.

Typical Applications

• Consumer and Commercial Electronics — Implement custom logic, interface bridging, and feature integration where high I/O and moderate logic density are needed.
• Networking and Communications Equipment — Handle protocol bridging, parallel interfaces, and control plane functions using the device's large I/O count and logic resources.
• Embedded Control and Instrumentation — Implement control logic, data aggregation, and peripheral interfacing within a compact BGA footprint.
• Prototyping and Evaluation — Validate mid-range FPGA designs and verify system integration with accessible I/O and on-chip memory resources.

Unique Advantages

• High Logic Density: 38,400 logic elements and 1,500,000 gates enable consolidation of multiple discrete functions into a single device, reducing overall component count.
• Extensive I/O: 444 user I/Os provide flexibility for wide buses and multiple peripheral connections, minimizing the need for external multiplexing.
• Compact, High-Pin Package: 676-FBGA (27×27) delivers a high pin count in a compact surface-mount form factor for space-constrained PCBs.
• Controlled Core Voltage: Operation within a 1.425 V to 1.575 V supply range supports stable core performance and predictable power planning.
• Commercial Temperature Support: Specified for 0 °C to 85 °C operation to match standard commercial product requirements.
• RoHS Compliance: Meets restricted-substance requirements for environmentally conscious designs.

Why Choose A3PE1500-2FGG676?

The A3PE1500-2FGG676 positions itself as a versatile, mid-range FPGA solution offering a combination of substantial logic capacity, high I/O count, and on-chip memory in a compact 676-FBGA surface-mount package. It is well suited to designers building commercial electronic systems that require significant digital integration without moving to larger, more costly device families.

For teams focused on PCB space efficiency and high pin-count routing, this device provides a balanced tradeoff of logic resources, I/O, and package density, backed by RoHS compliance and a defined commercial temperature range.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the A3PE1500-2FGG676. Our team can provide a tailored quote to support your project needs.