A3PE1500-2FG676I

The A3PE1500-2FG676I is a ProASIC3E field programmable gate array from Microchip Technology designed for industrial applications. It delivers a large logic fabric, substantial on-chip memory and a high I/O count in a compact 676-ball BGA package.

With 38,400 logic elements, approximately 0.276 Mbits of embedded memory and 444 I/O pins, this device targets designs that require high integration density, significant routing resources and operation across an industrial temperature range. The device operates from a nominal supply rail of 1.425 V to 1.575 V and is RoHS compliant.

Key Features

• Core Logic  38,400 logic elements providing a total of 1,500,000 gates for complex digital designs.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM to support buffering, state machines and data storage without external memory.
• I/O Density  444 user I/O pins to support large numbers of peripherals, buses and high-pin-count interfaces.
• Power Supply  Single-core supply range from 1.425 V to 1.575 V for systems with stable, narrow-voltage rails.
• Package & Mounting  676-ball BGA (676-FBGA, 27 × 27) in a surface-mount format for compact board integration and high pin density.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for harsh environments.
• Environmental Compliance  RoHS compliant to meet modern supply-chain environmental requirements.

Typical Applications

• Industrial automation  Control and interface functions that take advantage of the device’s industrial temperature rating and high I/O count.
• Communications and networking  Protocol bridging, packet handling and board-level data routing where large logic capacity and many I/Os are required.
• Embedded system integration  Custom peripheral aggregation, glue logic and system control leveraging abundant logic elements and on-chip RAM.
• Test and measurement equipment  Signal aggregation and processing tasks that benefit from a high gate count and broad I/O availability.

Unique Advantages

• High logic density: 38,400 logic elements and 1,500,000 gates enable complex state machines and parallel datapaths on a single device.
• Significant on-chip RAM: Approximately 0.276 Mbits of embedded memory reduces the need for external memory in many designs.
• Extensive I/O capability: 444 I/O pins allow direct connection to numerous peripherals and high-pin-count interfaces, simplifying board layouts.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in demanding environmental conditions.
• Compact, high-density package: 676-FBGA (27 × 27) surface-mount package balances small footprint with maximum pin availability.
• Regulatory compliance: RoHS compliant to meet environmental and regulatory sourcing requirements.

Why Choose A3PE1500-2FG676I?

The A3PE1500-2FG676I positions itself as a highly integrated, industrial-grade FPGA option for designs that need substantial logic resources, large I/O counts and onboard memory in a compact BGA package. Its specification set targets applications where density, reliability and deterministic supply requirements matter.

This device is well suited for engineering teams building industrial control systems, communication equipment and complex embedded platforms that require a balance of logic capacity, I/O flexibility and temperature resilience. Backed by Microchip Technology, it provides a clear hardware foundation for scalable, long-lived deployments.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the A3PE1500-2FG676I.